Inventor · disambiguated record
Takashi Kamiharako
Also filed as: KAMIHARAKO TAKASHI
5 granted patents·215 citations·filing 1987–1994
84Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0182US5566876AWire bonder and wire bonding methodKAIJO KK·Filed 1994·Granted Oct 22, 1996·83 cites·26 claims
- 0278US4872052ASemiconductor device inspection systemVIEW ENG·Filed 1987·Granted Oct 3, 1989·67 cites·18 claims
- 0357US5474224AWire bonder and wire bonding methodKAIJO KK·Filed 1994·Granted Dec 12, 1995·27 cites·39 claims
- 0451US5458280AWire bonder and wire bonding methodKAIJO KK·Filed 1994·Granted Oct 17, 1995·21 cites·25 claims
- 0546US5456403AWire bonder and wire bonding methodKAIJO KK·Filed 1994·Granted Oct 10, 1995·17 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →