Inventor · disambiguated record
Keiichi Maekawa
Also filed as: MAEKAWA KEIICHI
14 granted patents·3 pending applications·89 citations·filing 1990–2024
88Inventor score
Files withRENESAS ELECTRONICS CORP9MAEKAWA KEIICHI2HASHIMURA MASAYUKI1HITACHI ASTEMO LTD1KONAMI COMP ENTERTAINMENT1
Top patents by PatentIndex Score
17 records- 0184US5085182AVariable valve timing rocker arm arrangement for internal combustion engineNISSAN MOTOR·Filed 1990·Granted Feb 4, 1992·41 cites·7 claims
- 0278US9093546B2Method of manufacturing semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Jul 28, 2015·5 cites·7 claims
- 0373US10026481B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Jul 17, 2018·3 cites·16 claims
- 0466US8376027B2Core for thin-wall hollow casting and thin-wall hollow casting produced by production method employing itRIKEN KK·Filed 2008·Granted Feb 19, 2013·1 cites·7 claims
- 0566US6328657B1Threaded fastener and a method of making sameKURIMOTO LTD·Filed 2000·Granted Dec 11, 2001·8 cites·10 claims
- 0660US6270402B1Video game device, control method for processing of soliciting video characters to join simulated team, and readable recording medium recording control programs for processing of soliciting video characters to join simulated teamKONAMI COMP ENTERTAINMENT·Filed 1999·Granted Aug 7, 2001·31 cites·32 claims
- 0760US2025022924A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0858US12097591B2Method for determining propelling condition for shot medium, and method for manufacturing coil springHITACHI ASTEMO LTD·Filed 2022·Granted Sep 24, 2024·0 cites·18 claims
- 0946US10804164B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Oct 13, 2020·0 cites·7 claims
- 1045US10438663B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Oct 8, 2019·0 cites·9 claims
- 1143US9564540B2Method of manufacturing semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Feb 7, 2017·0 cites·11 claims
- 1241US8734600B2High strength steel wire for springHASHIMURA MASAYUKI·Filed 2010·Granted May 27, 2014·0 cites·3 claims
- 1338US8505510B2Sliding member and surface treatment method for the sameMAEKAWA KEIICHI·Filed 2009·Granted Aug 13, 2013·0 cites·8 claims
- 1437US10014067B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2016·Granted Jul 3, 2018·0 cites·14 claims
- 1535US10325899B2Semiconductor device including transistors formed in regions of semiconductor substrate and operation method of the sameRENESAS ELECTRONICS CORP·Filed 2018·Granted Jun 18, 2019·0 cites·15 claims
- 1634US2016190145A1Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 1731US2006133146A1Semiconductor device and a method of manufacturing the sameMAEKAWA KEIICHI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →