Inventor · disambiguated record
Yasunaga Kurokawa
Also filed as: KUROKAWA YASUNAGA
3 granted patents·23 citations·filing 1994–2000
70Inventor score
Files withFUJITSU LTD3
Top patents by PatentIndex Score
3 records- 0153US6389686B2Process for fabricating a thin multi-layer circuit boardFUJITSU LTD·Filed 2000·Granted May 21, 2002·4 cites·14 claims
- 0248US6184476B1Thin multi-layer circuit board having a remodeling pad layer and a metallic barrier layer with an exclusion zoneFUJITSU LTD·Filed 1997·Granted Feb 6, 2001·10 cites·4 claims
- 0345US5679268AThin multi-layer circuit board and process for fabricating the sameFUJITSU LTD·Filed 1994·Granted Oct 21, 1997·9 cites·21 claims
Join the waitlist — get patent alerts
Get an alert when Yasunaga Kurokawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →