Inventor · disambiguated record
Yuji Ohkura
Also filed as: OHKURA YUJI
11 granted patents·1 pending application·199 citations·filing 1988–2002
91Inventor score
Files withMITSUBISHI ELECTRIC CORP12
Top patents by PatentIndex Score
12 records- 0180US4847857ASingle wavelength semiconductor laserMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Jul 11, 1989·29 cites·5 claims
- 0268US5800622AVapor-phase growth apparatus and compound semiconductor device fabricated therebyMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Sep 1, 1998·46 cites·2 claims
- 0361US5835516ASemiconductor laser device and method of fabricating semiconductor laser deviceMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Nov 10, 1998·24 cites·28 claims
- 0461US5602414AInfrared detector having active regions and isolating regions formed of CdHgTeMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Feb 11, 1997·26 cites·7 claims
- 0551US6154476ASemiconductor laser diodeMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Nov 28, 2000·16 cites·7 claims
- 0648US5238785AMethod of manufacturing a diffraction grating for a semiconductor laserMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Aug 24, 1993·16 cites·12 claims
- 0745US6333946B1Semiconductor laser device and process for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Dec 25, 2001·12 cites·9 claims
- 0841US5198370AMethod for producing an infrared detectorMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Mar 30, 1993·9 cites·6 claims
- 0937US5386433ASemiconductor laser including periodic structures with different periods for producing a single wavelength of lightMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Jan 31, 1995·8 cites·2 claims
- 1037US2002196828A1Semiconductor laser deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 1136US5887011ASemiconductor laserMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Mar 23, 1999·7 cites·4 claims
- 1234US5706304ASemiconductor laser deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Jan 6, 1998·6 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →