Inventor · disambiguated record
Zhen Yu Guan
Also filed as: Guan zhen yu
7 granted patents·6 pending applications·0 citations·filing 2016–2025
71Inventor score
Top patents by PatentIndex Score
13 records- 0181US12341019B2Anti-oxidation layer to prevent dielectric loss from planarization processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 24, 2025·0 cites·20 claims
- 0280US2025293038A1Anti-oxidation layer to prevent dielectric loss from planarization processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0378US2025364257A1Substrate grinding tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0475US12107004B2In-situ CMP self-assembled monolayer for enhancing metal-dielectric adhesion and preventing metal diffusionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 1, 2024·0 cites·20 claims
- 0572US2025079299A1Method of forming bottom electrode via for memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0670US11854822B2Anti-oxidation layer to prevent dielectric loss from planarization processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 0767US2024332026A1Substrate grinding tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0866US12191250B2Method of forming bottom electrode via for memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 7, 2025·0 cites·20 claims
- 0965US10336692B2Method of forming paracyclophane containing functional group with disulfide bondMAY HWA ENTPR CORPORATION·Filed 2018·Granted Jul 2, 2019·0 cites·7 claims
- 1062US11810817B2In-situ CMP self-assembled monolayer for enhancing metal-dielectric adhesion and preventing metal diffusionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 7, 2023·0 cites·20 claims
- 1162US10246412B2Chemical film on substrate and method of forming the same, method of forming paracyclophane containing functional ground with disulfide bondMAY HWA ENTPR CORPORATION·Filed 2016·Granted Apr 2, 2019·0 cites·5 claims
- 1253US2025089576A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1338US2018273898A1Biological material and method of manufacturing the sameMAY HWA ENTPR CORPORATION·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →