Inventor · disambiguated record
Dwadasi Hare Rama Sarma
Also filed as: SARMA DWADASI H · SARMA DWADASI H R · SARMA DWADASI HARE RAMA
13 granted patents·1 pending application·400 citations·filing 1993–2007
93Inventor score
Top patents by PatentIndex Score
14 records- 0194US7352585B2Flip chip heat sink package and methodDELPHI TECH INC·Filed 2006·Granted Apr 1, 2008·37 cites·16 claims
- 0293US7180745B2Flip chip heat sink package and methodDELPHI TECH INC·Filed 2003·Granted Feb 20, 2007·77 cites·10 claims
- 0379US5395679AUltra-thick thick films for thermal management and current carrying capabilities in hybrid circuitsDELCO ELECTRONICS CORP·Filed 1993·Granted Mar 7, 1995·65 cites·13 claims
- 0478US5527627AInk composition for an ultra-thick thick film for thermal management of a hybrid circuitDELCO ELECTRONICS CORP·Filed 1994·Granted Jun 18, 1996·66 cites·9 claims
- 0575US6233817B1Method of forming thick-film hybrid circuit on a metal circuit boardDELPHI TECH INC·Filed 1999·Granted May 22, 2001·50 cites·19 claims
- 0673US7321098B2Laminate ceramic circuit board and process thereforDELPHI TECH INC·Filed 2004·Granted Jan 22, 2008·20 cites·10 claims
- 0767US5803344ADual-solder process for enhancing reliability of thick-film hybrid circuitsDELCO ELECTRONICS CORP·Filed 1996·Granted Sep 8, 1998·37 cites·16 claims
- 0856US7205652B2Electronic assembly including multiple substratesDELPHI TECH INC·Filed 2005·Granted Apr 17, 2007·1 cites·20 claims
- 0948US5716552AThick-film conductor compostions comprising silver or palladium particles coated with alumina or zirconiaDELCO ELECTRONICS CORP·Filed 1996·Granted Feb 10, 1998·13 cites·15 claims
- 1047US7574793B2Process of forming a laminate ceramic circuit boardDELPHI TECH INC·Filed 2007·Granted Aug 18, 2009·0 cites·12 claims
- 1143US5928568AThick film circuit having conductor composition with coated metallic particlesDELCO ELECTONICS CORP·Filed 1997·Granted Jul 27, 1999·15 cites·10 claims
- 1241US5803343ASolder process for enhancing reliability of multilayer hybrid circuitsDELCO ELECTRONICS CORP·Filed 1995·Granted Sep 8, 1998·13 cites·7 claims
- 1336US6328914B1Thick-film paste with insoluble additiveDELPHI TECH INC·Filed 1999·Granted Dec 11, 2001·6 cites·14 claims
- 1436US2005077614A1Semiconductor device heat sink package and methodFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →