Inventor · disambiguated record
Nobuto Yamazaki
Also filed as: YAMAZAKI NOBUTO
41 granted patents·1 pending application·777 citations·filing 1988–2002
98Inventor score
Files withSHINKAWA KK42
Top patents by PatentIndex Score
42 records- 0184US4932584AMethod of wire bondingSHINKAWA KK·Filed 1989·Granted Jun 12, 1990·74 cites·3 claims
- 0277US5197652AWire bonding method and apparatus with lead pressing meansSHINKAWA KK·Filed 1990·Granted Mar 30, 1993·56 cites·2 claims
- 0377US5058798AMethod for forming bump on semiconductor elementsSHINKAWA KK·Filed 1990·Granted Oct 22, 1991·41 cites·2 claims
- 0474US4989756ADispensing apparatusSHINKAWA KK·Filed 1989·Granted Feb 5, 1991·52 cites·3 claims
- 0573US5562396ANon-contact type moving tableSHINKAWA KK·Filed 1995·Granted Oct 8, 1996·32 cites·1 claims
- 0672US5486733ABonding apparatusSHINKAWA KK·Filed 1994·Granted Jan 23, 1996·44 cites·3 claims
- 0762US5439341ANon-contact type moving tableSHINKAWA KK·Filed 1993·Granted Aug 8, 1995·23 cites·2 claims
- 0861US5156323AWire bonding methodSHINKAWA KK·Filed 1992·Granted Oct 20, 1992·30 cites·2 claims
- 0960US5981371ABump forming methodSHINKAWA KK·Filed 1997·Granted Nov 9, 1999·25 cites·10 claims
- 1060US5884830ACapillary for a wire bonding apparatusSHINKAWA KK·Filed 1997·Granted Mar 23, 1999·24 cites·7 claims
- 1159US5906308ACapillary for use in a wire bonding apparatusSHINKAWA KK·Filed 1997·Granted May 25, 1999·23 cites·3 claims
- 1258US6080651AWire bonding methodSHINKAWA KK·Filed 1998·Granted Jun 27, 2000·22 cites·5 claims
- 1358US5870489ABall detection method and apparatus for wire-bonded partsSHINKAWA KK·Filed 1997·Granted Feb 9, 1999·25 cites·3 claims
- 1458US4938383ADispenser apparatusSHINKAWA KK·Filed 1989·Granted Jul 3, 1990·24 cites·3 claims
- 1556US5323948AWire clamperSHINKAWA KK·Filed 1993·Granted Jun 28, 1994·24 cites·4 claims
- 1655US4913336AMethod of tape bondingSHINKAWA KK·Filed 1989·Granted Apr 3, 1990·19 cites·2 claims
- 1753US5024367AWire bonding methodSHINKAWA KK·Filed 1990·Granted Jun 18, 1991·20 cites·2 claims
- 1849US5192018AWire bonding methodSHINKAWA KK·Filed 1992·Granted Mar 9, 1993·17 cites·3 claims
- 1948US5562395ANon-contact type moving tableSHINKAWA KK·Filed 1995·Granted Oct 8, 1996·10 cites·1 claims
- 2047US5046654AUltrasonic wire bonding apparatusSHINKAWA KK·Filed 1989·Granted Sep 10, 1991·13 cites·2 claims
- 2146US5275324AWire bonding apparatusSHINKAWA KK·Filed 1993·Granted Jan 4, 1994·16 cites·4 claims
- 2246US5058797ADetection method for wire bonding failuresSHINKAWA KK·Filed 1990·Granted Oct 22, 1991·18 cites·2 claims
- 2343US5501569ANon-contact type moving tableSHINKAWA KK·Filed 1995·Granted Mar 26, 1996·7 cites·1 claims
- 2442US5223063AMethod for bonding semiconductor elements to a tab tapeSHINKAWA KK·Filed 1992·Granted Jun 29, 1993·13 cites·4 claims
- 2542US5078312AWire bonding methodSHINKAWA KK·Filed 1990·Granted Jan 7, 1992·11 cites·2 claims
- 2641US5485398AMethod and apparatus for inspecting bent portions in wire loopsSHINKAWA KK·Filed 1995·Granted Jan 16, 1996·11 cites·3 claims
- 2741US5411195ABonding apparatusSHINKAWA KK·Filed 1994·Granted May 2, 1995·10 cites·8 claims
- 2841US5297722AWire bonding method and apparatusSHINKAWA KK·Filed 1993·Granted Mar 29, 1994·10 cites·3 claims
- 2941US5259548AWire bonding methodSHINKAWA KK·Filed 1992·Granted Nov 9, 1993·11 cites·2 claims
- 3040US4913763ADie bonding apparatusSHINKAWA KK·Filed 1988·Granted Apr 3, 1990·13 cites·1 claims
- 3139US5431527ANon-contact type moving table systemSHINKAWA KK·Filed 1993·Granted Jul 11, 1995·8 cites·1 claims
- 3238US5040293ABonding methodSHINKAWA KK·Filed 1990·Granted Aug 20, 1991·9 cites·2 claims
- 3337US5056217AMethod for manufacturing semiconductor elements equipped with leadsSHINKAWA KK·Filed 1990·Granted Oct 15, 1991·8 cites·2 claims
- 3436US2002102016A1Image processing method and deviceSHINKAWA KK·Filed 2002·Application pending·0 cites
- 3534US6089439AWire cutting and feeding device for use in wire bonding apparatusSHINKAWA KK·Filed 1997·Granted Jul 18, 2000·5 cites·4 claims
- 3633US5137201AWire bonding methodSHINKAWA KK·Filed 1990·Granted Aug 11, 1992·4 cites·6 claims
- 3733US5123585AWire bonding methodSHINKAWA KK·Filed 1990·Granted Jun 23, 1992·6 cites·1 claims
- 3832US5157985AX-Y table for bonding devicesSHINKAWA KK·Filed 1991·Granted Oct 27, 1992·4 cites·1 claims
- 3931US5106011ABump attachment methodSHINKAWA KK·Filed 1991·Granted Apr 21, 1992·2 cites·3 claims
- 4031US4986460AApparatus for manufacturing semiconductor devicesSHINKAWA KK·Filed 1989·Granted Jan 22, 1991·7 cites·4 claims
- 4130US4936944AWafer supplying apparatusSHINKAWA KK·Filed 1988·Granted Jun 26, 1990·3 cites·1 claims
- 4228US4975050AWorkpiece heating and feeding deviceSHINKAWA KK·Filed 1989·Granted Dec 4, 1990·3 cites·2 claims
Join the waitlist — get patent alerts
Get an alert when Nobuto Yamazaki files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →