Inventor · disambiguated record
Hitoyuki Sakanoue
Also filed as: SAKANOUE HITOYUKI
11 granted patents·243 citations·filing 1986–1994
92Inventor score
Top patents by PatentIndex Score
11 records- 0171US4886709AMember for semiconductor apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 1988·Granted Dec 12, 1989·38 cites·9 claims
- 0269US5034357AHeat-conductive aluminum nitride sintered body and method of manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1989·Granted Jul 23, 1991·30 cites·23 claims
- 0368US5010388AConnection structure between components for semiconductor apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 1988·Granted Apr 23, 1991·36 cites·9 claims
- 0468US4965659AMember for a semiconductor structureSUMITOMO ELECTRIC INDUSTRIES·Filed 1988·Granted Oct 23, 1990·34 cites·9 claims
- 0564US5036026ASintered body of aluminum nitride and method for producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1990·Granted Jul 30, 1991·17 cites·5 claims
- 0662US5529852AAluminum nitride sintered body having a metallized coating layer on its surfaceSUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted Jun 25, 1996·32 cites·14 claims
- 0759US5085923AHeat-conductive aluminum nitride sintered body and method of manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Feb 4, 1992·24 cites·6 claims
- 0843US5293509ASintered body of aluminum nitrideSUMITOMO ELECTRIC INDUSTRIES·Filed 1993·Granted Mar 8, 1994·11 cites·6 claims
- 0939US5219803ASintered body of aluminum nitrideSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Jun 15, 1993·10 cites·3 claims
- 1035US5264388ASintered body of aluminum nitrideSUMITOMO ELECTRIC INDUSTRIES·Filed 1992·Granted Nov 23, 1993·5 cites·3 claims
- 1135US4709844APressure welding bonding apparatusLIFE TECHNOLOGY RESEARCH FOUND·Filed 1986·Granted Dec 1, 1987·6 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when Hitoyuki Sakanoue files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →