Inventor · disambiguated record
Toshizumi Yoshino
Also filed as: YOSHINO TOSHIZUMI
7 granted patents·2 pending applications·81 citations·filing 1998–2014
84Inventor score
Top patents by PatentIndex Score
9 records- 0182US6692793B2Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such filmHITACHI CHEMICAL CO LTD·Filed 2001·Granted Feb 17, 2004·16 cites·15 claims
- 0274US6238840B1Photosensitive resin compositionHITACHI CHEMICAL CO LTD·Filed 1998·Granted May 29, 2001·38 cites·12 claims
- 0362US6583198B2Photo curable resin composition and photosensitive elementHITACHI CHEMICAL CO LTD·Filed 1998·Granted Jun 24, 2003·15 cites·9 claims
- 0460US9075307B2Photosensitive resin composition for protective film of printed wiring board for semiconductor packageKURAFUCHI KAZUHIKO·Filed 2009·Granted Jul 7, 2015·3 cites·9 claims
- 0557US7071243B2Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such filmHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jul 4, 2006·3 cites·12 claims
- 0653US7049036B1Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, resist pattern and substrate having the resist pattern laminated thereonHITACHI CHEMICAL CO LTD·Filed 2000·Granted May 23, 2006·6 cites·31 claims
- 0748US10111328B2Photosensitive resin composition, dry film using same, printed wiring board, and method for producing printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2014·Granted Oct 23, 2018·0 cites·21 claims
- 0839US2002169226A1Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such filmFiled 2002·Application pending·0 cites
- 0932US2006141381A1Photosensitive resin composition, and photosensitive element, method for forming resist pattern and printed wiring board using the compositionHITACHI CHEMICAL CO LTD·Filed 2003·Application pending·0 cites
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