Inventor · disambiguated record
Qixing Bai
Also filed as: BAI QIXING
3 granted patents·1 pending application·1 citations·filing 2015–2019
47Inventor score
Technology areasH01C
Top patents by PatentIndex Score
4 records- 0161US10636550B2Composite thermistor chip and preparation method thereofEXSENSE ELECTRONICS TECH CO LTD·Filed 2018·Granted Apr 28, 2020·1 cites·7 claims
- 0244US11631511B2Thermistor chip and preparation method thereofDINGSENSE ELECTRONICS TECH CO LTD·Filed 2019·Granted Apr 18, 2023·0 cites·15 claims
- 0330US10330539B2High precision high reliability and quick response thermosensitive chip and manufacturing method thereofEXSENSE ELECTRONICS TECH CO LTD·Filed 2015·Granted Jun 25, 2019·0 cites·9 claims
- 0422US2017250011A1Thermosensitive chip for composite electrodeEXSENSE ELECTRONICS TECH CO LTD·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Qixing Bai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →