Inventor · disambiguated record
Jiankai Ye
Also filed as: YE JIANKAI
2 granted patents·1 pending application·1 citations·filing 2015–2018
30Inventor score
Technology areasH01C
Files withEXSENSE ELECTRONICS TECH CO LTD3
Top patents by PatentIndex Score
3 records- 0161US10636550B2Composite thermistor chip and preparation method thereofEXSENSE ELECTRONICS TECH CO LTD·Filed 2018·Granted Apr 28, 2020·1 cites·7 claims
- 0230US10330539B2High precision high reliability and quick response thermosensitive chip and manufacturing method thereofEXSENSE ELECTRONICS TECH CO LTD·Filed 2015·Granted Jun 25, 2019·0 cites·9 claims
- 0322US2017250011A1Thermosensitive chip for composite electrodeEXSENSE ELECTRONICS TECH CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →