Inventor · disambiguated record
Gengwei Jiang
Also filed as: JIANG GENGWEI
6 granted patents·3 pending applications·69 citations·filing 2007–2025
81Inventor score
Technology areasH10P
Top patents by PatentIndex Score
9 records- 0194US8512818B1Cascaded cure approach to fabricate highly tensile silicon nitride filmsVARADARAJAN BHADRI·Filed 2012·Granted Aug 20, 2013·21 cites·18 claims
- 0294US8211510B1Cascaded cure approach to fabricate highly tensile silicon nitride filmsVARADARAJAN BHADRI·Filed 2007·Granted Jul 3, 2012·33 cites·25 claims
- 0389US8268722B2Interfacial capping layers for interconnectsYU JENGYI·Filed 2010·Granted Sep 18, 2012·13 cites·23 claims
- 0473US2025046613A1Method for providing doped silicon using a diffusion barrier layerLAM RES CORP·Filed 2024·Application pending·0 cites
- 0570US8753978B2Metal and silicon containing capping layers for interconnectsYU JENGYI·Filed 2012·Granted Jun 17, 2014·2 cites·21 claims
- 0668US2025266274A1Dynamic process control in semiconductor manufacturingLAM RES CORP·Filed 2025·Application pending·0 cites
- 0762US12125705B2Method for providing doped silicon using a diffusion barrier layerLAM RES CORP·Filed 2020·Granted Oct 22, 2024·0 cites·20 claims
- 0861US12322619B2Dynamic process control in semiconductor manufacturingLAM RES CORP·Filed 2020·Granted Jun 3, 2025·0 cites·21 claims
- 0953US2014216336A1Metal and silicon containing capping layers for interconnectsNOVELLUS SYSTEMS INC·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →