Inventor · disambiguated record
Frank D. Egitto
Also filed as: EGITTO FRANK · EGITTO FRANK D · EGITTO FRANK DANIEL
88 granted patents·13 pending applications·1,936 citations·filing 1981–2012
99Inventor score
Top patents by PatentIndex Score
101 records- 0198US7800916B2Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Sep 21, 2010·80 cites·31 claims
- 0298US7301108B2Multi-layered interconnect structure using liquid crystalline polymer dielectricIBM·Filed 2004·Granted Nov 27, 2007·105 cites·10 claims
- 0398US7292055B2Interposer for use with test apparatusENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Nov 6, 2007·66 cites·9 claims
- 0497US5774340APlanar redistribution structure and printed wiring deviceIBM·Filed 1996·Granted Jun 30, 1998·271 cites·11 claims
- 0596US7501839B2Interposer and test assembly for testing electronic devicesENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 10, 2009·39 cites·22 claims
- 0696US7011531B2Membrane probe with anchored elementsIBM·Filed 2005·Granted Mar 14, 2006·111 cites·17 claims
- 0794US7738249B2Circuitized substrate with internal cooling structure and electrical assembly utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Jun 15, 2010·32 cites·22 claims
- 0894US6252012B1Method for producing a diffusion barrier and polymeric article having a diffusion barrierIBM·Filed 1999·Granted Jun 26, 2001·69 cites·8 claims
- 0994US5693928AMethod for producing a diffusion barrier and polymeric article having a diffusion barrierIBM·Filed 1996·Granted Dec 2, 1997·74 cites·11 claims
- 1092US6826830B2Multi-layered interconnect structure using liquid crystalline polymer dielectricIBM·Filed 2002·Granted Dec 7, 2004·42 cites·15 claims
- 1191US8607445B1Substrate having internal capacitor and method of making sameDAS RABINDRA N·Filed 2012·Granted Dec 17, 2013·12 cites·19 claims
- 1290US6509546B1Laser excision of laminate chip carriersIBM·Filed 2000·Granted Jan 21, 2003·52 cites·29 claims
- 1389US7511518B2Method of making an interposerENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Mar 31, 2009·14 cites·10 claims
- 1489US6156484AGray scale etching for thin flexible interposerIBM·Filed 1998·Granted Dec 5, 2000·78 cites·12 claims
- 1588US4376672AMaterials and methods for plasma etching of oxides and nitrides of siliconAPPLIED MATERIALS INC·Filed 1981·Granted Mar 15, 1983·67 cites·12 claims
- 1686US8558374B2Electronic package with thermal interposer and method of making sameMARKOVICH VOYA R·Filed 2011·Granted Oct 15, 2013·10 cites·22 claims
- 1786US7596862B2Method of making a circuitized substrateIBM·Filed 2007·Granted Oct 6, 2009·8 cites·12 claims
- 1884US6074895AMethod of forming a flip chip assemblyIBM·Filed 1997·Granted Jun 13, 2000·63 cites·14 claims
- 1984US4412885AMaterials and methods for plasma etching of aluminum and aluminum alloysAPPLIED MATERIALS INC·Filed 1982·Granted Nov 1, 1983·54 cites·17 claims
- 2081US7342183B2Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Mar 11, 2008·7 cites·19 claims
- 2181US6881072B2Membrane probe with anchored elementsIBM·Filed 2002·Granted Apr 19, 2005·24 cites·18 claims
- 2281US5460921AHigh density pattern template: materials and processes for the application of conductive pastesIBM·Filed 1993·Granted Oct 24, 1995·44 cites·15 claims
- 2380US6522014B1Fabrication of a metalized blind viaIBM·Filed 2000·Granted Feb 18, 2003·23 cites·20 claims
- 2479US6518516B2Multilayered laminateIBM·Filed 2002·Granted Feb 11, 2003·24 cites·17 claims
- 2578US7679005B2Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 16, 2010·8 cites·20 claims
- 2678US5958996AMethod for producing a diffusion barrier and polymeric article having a diffusion barrierIBM·Filed 1997·Granted Sep 28, 1999·23 cites·8 claims
- 2777US6206997B1Method for bonding heat sinks to overmolds and device formed therebyIBM·Filed 1999·Granted Mar 27, 2001·36 cites·10 claims
- 2876US7981245B2Multi-layered interconnect structure using liquid crystalline polymer dielectricIBM·Filed 2007·Granted Jul 19, 2011·4 cites·11 claims
- 2976US7777136B2Multi-layered interconnect structure using liquid crystalline polymer dielectricIBM·Filed 2007·Granted Aug 17, 2010·5 cites·11 claims
- 3075US7897877B2Capacitive substrateENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 1, 2011·5 cites·11 claims
- 3174US8541687B2Coreless layer buildup structureMARKOVICH VOYA·Filed 2010·Granted Sep 24, 2013·3 cites·18 claims
- 3274US7875811B2High speed interposerENDICOTT INTERCONNECT TECH INC·Filed 2008·Granted Jan 25, 2011·4 cites·5 claims
- 3373US8240027B2Method of making circuitized substrates having film resistors as part thereofEGITTO FRANK D·Filed 2008·Granted Aug 14, 2012·7 cites·16 claims
- 3473US7823274B2Method of making multilayered circuitized substrate assemblyENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Nov 2, 2010·4 cites·4 claims
- 3573US7629541B2High speed interposerENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Dec 8, 2009·4 cites·7 claims
- 3673US6265462B1Method for Producing a Diffusion Barrier and Polymeric Article Having a Diffusion BarrierIBM·Filed 2000·Granted Jul 24, 2001·7 cites·8 claims
- 3772US8405229B2Electronic package including high density interposer and circuitized substrate assembly utilizing sameANTESBERGER TIMOTHY·Filed 2009·Granted Mar 26, 2013·6 cites·15 claims
- 3872US6924224B2Method of forming filled blind viasIBM·Filed 2003·Granted Aug 2, 2005·16 cites·22 claims
- 3971US5789121AHigh density template: materials and processes for the application of conductive pastesIBM·Filed 1997·Granted Aug 4, 1998·28 cites·5 claims
- 4070US8501575B2Method of forming multilayer capacitors in a printed circuit substrateDAS RABINDRA N·Filed 2010·Granted Aug 6, 2013·2 cites·4 claims
- 4170US7045897B2Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted May 16, 2006·14 cites·29 claims
- 4270US6000130AProcess for making planar redistribution structureIBM·Filed 1998·Granted Dec 14, 1999·33 cites·13 claims
- 4369US7334323B2Method of making mutilayered circuitized substrate assembly having sintered paste connectionsENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Feb 26, 2008·4 cites·21 claims
- 4468US8536459B2Coreless layer buildup structure with LGAMARKOVICH VOYA·Filed 2010·Granted Sep 17, 2013·2 cites·18 claims
- 4568US6719871B2Method for bonding heat sinks to overmolds and device formed therebyIBM·Filed 2001·Granted Apr 13, 2004·10 cites·10 claims
- 4668US5194713ARemoval of excimer laser debris using carbon dioxide laserIBM·Filed 1991·Granted Mar 16, 1993·45 cites·2 claims
- 4767US8245392B2Method of making high density interposer and electronic package utilizing sameANTESBERGER TIMOTHY·Filed 2009·Granted Aug 21, 2012·4 cites·20 claims
- 4866US8499445B1Method of forming an electrically conductive printed lineDAS RABINDRA N·Filed 2011·Granted Aug 6, 2013·1 cites·26 claims
- 4966US6306683B1Method of forming a flip chip assembly, and a flip chip assembly formed by the methodIBM·Filed 2000·Granted Oct 23, 2001·16 cites·42 claims
- 5066US6250540B1Fluxless joining process for enriched soldersIBM·Filed 1999·Granted Jun 26, 2001·23 cites·20 claims
Showing the top 50 of 101 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →