Inventor · disambiguated record
Kyung-Tae Wi
Also filed as: WI KYUNG-TAE
4 granted patents·4 pending applications·16 citations·filing 2004–2010
70Inventor score
Top patents by PatentIndex Score
8 records- 0179US7485494B2Dicing die adhesive film for semiconductorLS CABLE LTD·Filed 2006·Granted Feb 3, 2009·5 cites·12 claims
- 0267US7768141B2Dicing die attachment film and method for packaging semiconductor using sameLG INNOTEK CO LTD·Filed 2007·Granted Aug 3, 2010·4 cites·14 claims
- 0353US7968977B2Dicing film having shrinkage release film and method of manufacturing semiconductor package using the sameLG INNOTEK CO LTD·Filed 2004·Granted Jun 28, 2011·7 cites·4 claims
- 0440US2007134847A1Die-attaching paste composition and method for hardening the sameKANG BYOUNG-UN·Filed 2006·Application pending·0 cites
- 0536US2010087067A1Method for packaging semiconductorSEO JOON-MO·Filed 2007·Application pending·0 cites
- 0635US2009198013A1Adhesive film for semiconductorSHIN DONG-CHEON·Filed 2005·Application pending·0 cites
- 0734US8101527B2Dicing film having shrinkage release film and method for manufacturing semiconductor package using the sameSEO JOON MO·Filed 2010·Granted Jan 24, 2012·0 cites·3 claims
- 0834US2007101877A1Dual printing mask for screen printingSEO JOON-MO·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kyung-Tae Wi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →