Inventor · disambiguated record
Wonil Kwon
Also filed as: KWON WONIL
3 granted patents·18 citations·filing 2010–2012
63Inventor score
Top patents by PatentIndex Score
3 records- 0186US8304296B2Semiconductor packaging system with multipart conductive pillars and method of manufacture thereofKO CHANHOON·Filed 2010·Granted Nov 6, 2012·13 cites·20 claims
- 0277US9406579B2Semiconductor device and method of controlling warpage in semiconductor packageCHOI DAESIK·Filed 2012·Granted Aug 2, 2016·5 cites·27 claims
- 0344US9401289B2Semiconductor device and method of backgrinding and singulation of semiconductor wafer while reducing kerf shifting and protecting wafer surfacesKIM MINJUNG·Filed 2012·Granted Jul 26, 2016·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →