Inventor · disambiguated record
Yifan Kao
Also filed as: KAO YIFAN
4 granted patents·1 pending application·3 citations·filing 2019–2023
62Inventor score
Technology areasH10W
Files withAPPLE INC5
Top patents by PatentIndex Score
5 records- 0190US11862597B2Asymmetric stackup structure for SoC package substratesAPPLE INC·Filed 2021·Granted Jan 2, 2024·2 cites·20 claims
- 0273US12322721B2Asymmetric Stackup Structure for SoC package substratesAPPLE INC·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 0368US11908819B2Semiconductor packaging substrate fine pitch metal bump and reinforcement structuresAPPLE INC·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 0468US11545455B2Semiconductor packaging substrate fine pitch metal bump and reinforcement structuresAPPLE INC·Filed 2019·Granted Jan 3, 2023·1 cites·22 claims
- 0554US2025046689A1Routing Substrates with Cavities for Component StackingAPPLE INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →