Inventor · disambiguated record
Shinjiro Fujii
Also filed as: FUJII SHINJIRO
5 granted patents·3 pending applications·7 citations·filing 2010–2018
70Inventor score
Top patents by PatentIndex Score
8 records- 0175US10808150B2Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging elementHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 20, 2020·3 cites·14 claims
- 0265US9868884B2Adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging elementHITACHI CHEMICAL CO LTD·Filed 2015·Granted Jan 16, 2018·2 cites·15 claims
- 0359US10947326B2Adhesive composition, cured article, semiconductor device, and production method for sameHITACHI CHEMICAL CO LTD·Filed 2016·Granted Mar 16, 2021·1 cites·19 claims
- 0456US10358580B2Adhesive composition, resin cured product obtained from adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging elementHITACHI CHEMICAL CO LTD·Filed 2015·Granted Jul 23, 2019·1 cites·13 claims
- 0545US9920227B2Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging elementHITACHI CHEMICAL CO LTD·Filed 2015·Granted Mar 20, 2018·0 cites·18 claims
- 0635US2012202015A1Method for manufacturing adhesion body, method for manufacturing substrate with adhesive pattern, and substrate with adhesive patternIKEDA AYA·Filed 2012·Application pending·0 cites
- 0731US2012263946A1Semiconductor device, method for manufacturing semiconductor device, and semiconductor wafer provided with adhesive layerMITSUKURA KAZUYUKI·Filed 2010·Application pending·0 cites
- 0831US2012248634A1Method for manufacturing film-like adhesive, adhesive sheet, semiconductor device, and method for manufacturing semiconductor deviceMITSUKURA KAZUYUKI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →