Inventor · disambiguated record
Hidenobu Takahira
Also filed as: TAKAHIRA HIDENOBU
3 granted patents·2 pending applications·16 citations·filing 2006–2009
64Inventor score
Top patents by PatentIndex Score
5 records- 0176US7525201B2Semiconductor chip having solder bumps and dummy bumpsFUJIFILM CORP·Filed 2006·Granted Apr 28, 2009·10 cites·4 claims
- 0268US7855136B2Method of mounting semiconductor chip to circuit substrate using solder bumps and dummy bumpsFUJIFILMCORPORATION·Filed 2008·Granted Dec 21, 2010·6 cites·10 claims
- 0347US9372551B2Image reading apparatusOGASAWARA YASUHIRO·Filed 2009·Granted Jun 21, 2016·0 cites·19 claims
- 0441US2010142856A1Image reading apparatus, and reading methodTAKEUCHI SHIN·Filed 2009·Application pending·0 cites
- 0540US2009166774A1Wire bonding method and semiconductor deviceFUJIFILM CORP·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →