Inventor · disambiguated record
Hsiao Jung Lin
Also filed as: LIN HSIAO-JUNG
3 granted patents·2 pending applications·12 citations·filing 2011–2021
57Inventor score
Top patents by PatentIndex Score
5 records- 0182US8411443B2Slidingly-engaged heat-dissipating assembly for memory and memory device having the sameCHEN WEI-HAU·Filed 2011·Granted Apr 2, 2013·12 cites·10 claims
- 0253US11557555B2Bumped pad structureWESTERN DIGITAL TECH INC·Filed 2020·Granted Jan 17, 2023·0 cites·18 claims
- 0349US12022618B2Printed circuit board with stacked passive componentsWESTERN DIGITAL TECH INC·Filed 2021·Granted Jun 25, 2024·0 cites·16 claims
- 0439US2022398169A1Method, system and computer-readable medium for synthetic incremental data backupQNAP SYSTEMS INC·Filed 2021·Application pending·0 cites
- 0535US2014202675A1Heat dissipation unit used in memory deviceCOMPTAKE TECHNOLOGY INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →