Inventor · disambiguated record
Jim Tappan
Also filed as: TAPPAN JIM
2 granted patents·1 pending application·42 citations·filing 2005–2020
63Inventor score
Technology areasH10P
Files withLAM RES CORP3
Top patents by PatentIndex Score
3 records- 0193US7431788B2Method of protecting a bond layer in a substrate support adapted for use in a plasma processing systemLAM RES CORP·Filed 2005·Granted Oct 7, 2008·36 cites·29 claims
- 0275US7998296B2Method of protecting a bond layer in a substrate support adapted for use in a plasma processing systemLAM RES CORP·Filed 2008·Granted Aug 16, 2011·6 cites·17 claims
- 0343US2022122878A1Automated process module ring positioning and replacementLAM RES CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →