Inventor · disambiguated record
Bih Wen Fon
Also filed as: FON BIH WEN
3 granted patents·2 pending applications·10 citations·filing 2012–2017
61Inventor score
Top patents by PatentIndex Score
5 records- 0181US9281258B1Chip scale packages and related methodsSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted Mar 8, 2016·6 cites·20 claims
- 0267US8759978B2Chip-on-lead package and method of formingPRAJUCKAMOL ATAPOL·Filed 2012·Granted Jun 24, 2014·4 cites·20 claims
- 0351US2016111581A1Packaged semiconductor devices and related methodsSEMICONDUCTOR COMPONENTS IND·Filed 2014·Application pending·0 cites
- 0449US9018044B2Chip-on-lead package and method of formingSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted Apr 28, 2015·0 cites·20 claims
- 0546US2017162742A1Packaged semiconductor devices and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →