Inventor · disambiguated record
Hoe Chul Kim
Also filed as: KIM HOE-CHUL
4 granted patents·10 citations·filing 2019–2019
65Inventor score
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0188US10906283B2Wafer bonding apparatus for directly bonding wafers and a wafer bonding system having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 2, 2021·5 cites·19 claims
- 0284US10833047B2Apparatuses of bonding substrates and methods of bonding substratesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 10, 2020·5 cites·15 claims
- 0361US11283235B2Semiconductor laser deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 22, 2022·0 cites·20 claims
- 0446US11728200B2Wafer bonding apparatusesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 15, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →