Inventor · disambiguated record
Chi-Hsing Hsu
Also filed as: HSU CHI-HSING
56 granted patents·31 pending applications·784 citations·filing 2000–2024
98Inventor score
Files withVIA TECH INC35HSU CHI-HSING18TAIWAN SEMICONDUCTOR MFG CO LTD13AZUREWAVE TECHNOLOGIES INC7SILICON OPTRONICS INC3
Top patents by PatentIndex Score
87 records- 0198US7224062B2Chip package with embedded panel-shaped componentVIA TECH INC·Filed 2005·Granted May 29, 2007·83 cites·20 claims
- 0298US6861740B2Flip-chip die and flip-chip package substrateVIA TECH INC·Filed 2004·Granted Mar 1, 2005·133 cites·22 claims
- 0397US6809262B1Flip chip package carrierVIA TECH INC·Filed 2003·Granted Oct 26, 2004·113 cites·23 claims
- 0496US11031395B2Method of forming high performance MOSFETs having varying channel structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 8, 2021·13 cites·20 claims
- 0595US6882057B2Quad flat no-lead chip carrierVIA TECH INC·Filed 2003·Granted Apr 19, 2005·109 cites·15 claims
- 0691US8054639B2Image-sensing module for reducing overall thickness thereof and preventing EMIAZUREWAVE TECHNOLOGIES INC·Filed 2008·Granted Nov 8, 2011·20 cites·15 claims
- 0788US11855090B2High performance MOSFETs having varying channel structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·1 cites·20 claims
- 0887US7470864B2Multi-conducting through hole structureVIA TECH INC·Filed 2005·Granted Dec 30, 2008·14 cites·9 claims
- 0987US7365418B2Multi-chip structureVIA TECH INC·Filed 2006·Granted Apr 29, 2008·15 cites·20 claims
- 1087US7230332B2Chip package with embedded componentVIA TECH INC·Filed 2005·Granted Jun 12, 2007·16 cites·26 claims
- 1185US11222958B2Negative capacitance transistor with external ferroelectric structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 11, 2022·2 cites·20 claims
- 1285US8519428B2Vertical stacked light emitting structureHSU CHI-HSING·Filed 2011·Granted Aug 27, 2013·9 cites·11 claims
- 1385US7547965B2Package and package module of the packageVIA TECH INC·Filed 2006·Granted Jun 16, 2009·13 cites·20 claims
- 1485US6596560B1Method of making wafer level packaging and chip structureVIA TECH INC·Filed 2002·Granted Jul 22, 2003·35 cites·16 claims
- 1584US11532622B2High performance MOSFETs having different device characteristicsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 20, 2022·2 cites·20 claims
- 1684US10861973B2Negative capacitance transistor with a diffusion blocking layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·2 cites·20 claims
- 1784US7608923B2Electronic device with flexible heat spreaderVIA TECH INC·Filed 2007·Granted Oct 27, 2009·11 cites·20 claims
- 1883US11349008B2Negative capacitance transistor having a multilayer ferroelectric structure or a ferroelectric layer with a gradient doping profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 31, 2022·2 cites·20 claims
- 1983US7193324B2Circuit structure of package substrateVIA TECH INC·Filed 2005·Granted Mar 20, 2007·11 cites·24 claims
- 2081US2024113119A1High performance mosfets having varying channel structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2179US7378601B2Signal transmission structure and circuit substrate thereofVIA TECH INC·Filed 2005·Granted May 27, 2008·8 cites·10 claims
- 2279US7291916B2Signal transmission structure and circuit substrate thereofVIA TECH INC·Filed 2005·Granted Nov 6, 2007·9 cites·20 claims
- 2379US7038309B2Chip package structure with glass substrateVIA TECH INC·Filed 2003·Granted May 2, 2006·28 cites·20 claims
- 2479US2024266417A1Negative capacitance transistor with external ferroelectric structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2578US12272751B2Negative capacitance transistor with a diffusion blocking layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 2678US7129568B2Chip package and electrical connection structure between chip and substrateVIA TECH INC·Filed 2004·Granted Oct 31, 2006·25 cites·16 claims
- 2776US11961897B2Negative capacitance transistor with external ferroelectric structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
- 2875US8093509B2Flexible thin image-sensing module with anti-EMI function and flexible thin PCB module with anti-EMI functionHSU CHI-HSING·Filed 2009·Granted Jan 10, 2012·4 cites·20 claims
- 2974US11784235B2Negative capacitance transistor having a multilayer ferroelectric structure or a ferroelectric layer with a gradient doping profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 3073US7129146B2Flip chip package and process of forming the sameVIA TECH INC·Filed 2004·Granted Oct 31, 2006·16 cites·12 claims
- 3172US10879238B2Negative capacitance finFET and method of fabricating thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·1 cites·20 claims
- 3272US9786709B1Portable electronic device and image capturing module thereofHSU CHI-HSING·Filed 2016·Granted Oct 10, 2017·2 cites·10 claims
- 3372US9349903B2Image sensing module and method of manufacturing the sameAZUREWAVE TECHNOLOGIES INC·Filed 2013·Granted May 24, 2016·2 cites·10 claims
- 3471US7382629B2Circuit substrate and method of manufacturing plated through slot thereonVIA TECH INC·Filed 2006·Granted Jun 3, 2008·4 cites·16 claims
- 3571US7145234B2Circuit carrier and package structure thereofVIA TECH INC·Filed 2005·Granted Dec 5, 2006·5 cites·20 claims
- 3671US6740965B2Flip-chip package substrateVIA TECH INC·Filed 2002·Granted May 25, 2004·15 cites·13 claims
- 3770US11581436B2Negative capacitance transistor with a diffusion blocking layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·20 claims
- 3870US8368003B2Image-capturing module for simplifying optical component and reducing assembly timeAZUREWAVE TECHNOLOGIES INC·Filed 2010·Granted Feb 5, 2013·2 cites·13 claims
- 3963US8274594B2Image-capturing module for simplifying optical componentHSU CHI-HSING·Filed 2010·Granted Sep 25, 2012·2 cites·11 claims
- 4062US7642634B2Chip package and stacked structure of chip packagesVIA TECH INC·Filed 2006·Granted Jan 5, 2010·2 cites·10 claims
- 4162US7361982B2Bumpless chip packageVIA TECH INC·Filed 2005·Granted Apr 22, 2008·2 cites·20 claims
- 4260US8053969B2LED package structure for increasing light-emitting efficiencyAZUREWAVE TECHNOLOGIES INC·Filed 2010·Granted Nov 8, 2011·1 cites·20 claims
- 4360US6774498B2Flip-chip package substrateVIA TECH INC·Filed 2002·Granted Aug 10, 2004·9 cites·20 claims
- 4460US6643136B2Multi-chip package with embedded cooling elementVIA TECHNOLGIES INC·Filed 2002·Granted Nov 4, 2003·12 cites·6 claims
- 4559US7253526B2Semiconductor packaging substrate and method of producing the sameVIA TECH INC·Filed 2005·Granted Aug 7, 2007·1 cites·10 claims
- 4657US6710459B2Flip-chip die for joining with a flip-chip substrateVIA TECH INC·Filed 2002·Granted Mar 23, 2004·7 cites·12 claims
- 4756US7053638B2Surrounding structure for a probe cardVIA TECH INC·Filed 2004·Granted May 30, 2006·6 cites·8 claims
- 4855US6946738B2Semiconductor packaging substrate and method of producing the sameVIA TECH INC·Filed 2002·Granted Sep 20, 2005·5 cites·8 claims
- 4952US6777804B1Flip-chip package substrateVIA TECH INC·Filed 2003·Granted Aug 17, 2004·4 cites·25 claims
- 5050US2008042257A1Die pad arrangement and bumpless chip package applying the sameVIA TECH INC·Filed 2007·Application pending·0 cites
Showing the top 50 of 87 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →