Inventor · disambiguated record
Anju Okada
Also filed as: OKADA ANJU
2 granted patents·2 citations·filing 2021–2022
34Inventor score
Technology areasH01G
Files withTAIYO YUDEN KK2
Top patents by PatentIndex Score
2 records- 0185US11915879B2Electronic component, circuit board arrangement and method of manufacturing electronic componentTAIYO YUDEN KK·Filed 2021·Granted Feb 27, 2024·2 cites·17 claims
- 0254US12068115B2Ceramic electronic component, circuit substrate arrangement, and method of manufacturing ceramic electronic componentTAIYO YUDEN KK·Filed 2022·Granted Aug 20, 2024·0 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when Anju Okada files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →