Inventor · disambiguated record
Shinobu Kourakata
Also filed as: KOURAKATA SHINOBU
5 granted patents·3 pending applications·49 citations·filing 2004–2016
80Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0187US9460982B2Integrated heat spreader for multi-chip packagesINTEL CORP·Filed 2015·Granted Oct 4, 2016·6 cites·18 claims
- 0283US9236323B2Integrated heat spreader for multi-chip packagesINTEL CORP·Filed 2013·Granted Jan 12, 2016·6 cites·7 claims
- 0378US7033911B2Adhesive of folded packageINTEL CORP·Filed 2004·Granted Apr 25, 2006·29 cites·17 claims
- 0459US7335973B2Adhesive of folder packageINTEL CORP·Filed 2006·Granted Feb 26, 2008·2 cites·17 claims
- 0550US7224075B2Methods and systems for attaching die in stacked-die packagesINTEL CORP·Filed 2004·Granted May 29, 2007·6 cites·12 claims
- 0648US2016372398A1Integrated heat spreader for multi-chip packagesINTEL CORP·Filed 2016·Application pending·0 cites
- 0738US2006038276A1Methods and systems for attaching die in stacked-die packagesMANEPALLI RAHUL N·Filed 2005·Application pending·0 cites
- 0831US2019043778A1Swaging process for complex integrated heat spreadersINTEL CORP·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →