Inventor · disambiguated record
Satoshi Sendai
Also filed as: SENDAI SATOSHI
12 granted patents·3 pending applications·334 citations·filing 1976–2006
92Inventor score
Top patents by PatentIndex Score
15 records- 0197US4110260AElectroconductive composite ceramicsTDK ELECTRONICS CO LTD·Filed 1976·Granted Aug 29, 1978·137 cites·17 claims
- 0284US6558518B1Method and apparatus for plating substrate and plating facilityEBARA CORP·Filed 2000·Granted May 6, 2003·36 cites·17 claims
- 0384US6517689B1Plating deviceEBARA CORP·Filed 1999·Granted Feb 11, 2003·57 cites·29 claims
- 0478US6660139B1Plating apparatus and methodEBARA CORP·Filed 2000·Granted Dec 9, 2003·19 cites·10 claims
- 0578US6365017B1Substrate plating deviceEBARA CORP·Filed 1999·Granted Apr 2, 2002·31 cites·34 claims
- 0672US6793794B2Substrate plating apparatus and methodEBARA CORP·Filed 2002·Granted Sep 21, 2004·7 cites·8 claims
- 0764US7166204B2Plating apparatus and methodEBARA CORP·Filed 2002·Granted Jan 23, 2007·4 cites·5 claims
- 0858US7241372B2Plating apparatus and plating liquid removing methodEBARA CORP·Filed 2003·Granted Jul 10, 2007·6 cites·21 claims
- 0956US6689216B2Plating apparatus and plating liquid removing methodEBARA CORP·Filed 2001·Granted Feb 10, 2004·5 cites·32 claims
- 1048US2006144714A1Substrate plating method and apparatusHONGO AKIHISA·Filed 2006·Application pending·0 cites
- 1147US6365020B1Wafer plating jigEBARA CORP·Filed 1999·Granted Apr 2, 2002·14 cites·4 claims
- 1247US2006185976A1Plating apparatus and methodSENDAI SATOSHI·Filed 2006·Application pending·0 cites
- 1345US7033463B1Substrate plating method and apparatusEBARA CORP·Filed 1999·Granted Apr 25, 2006·10 cites·14 claims
- 1439US2004089555A1Plating apparatus and methodFiled 2003·Application pending·0 cites
- 1538US6500317B1Plating apparatus for detecting the conductivity between plating contacts on a substrateEBARA CORP·Filed 1998·Granted Dec 31, 2002·8 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →