Inventor · disambiguated record
Kuo-Hwa Tzeng
Also filed as: TZENG KUO HWA
23 granted patents·2 pending applications·147 citations·filing 2008–2024
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD15CHEN NENG-KUO6ADVANCED SEMICONDUCTOR ENG2TAIWAN SEMICONDUCTOR MFG2
Top patents by PatentIndex Score
25 records- 0197US7655532B1STI film property using SOD post-treatmentTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Feb 2, 2010·54 cites·13 claims
- 0296US8319311B2Hybrid STI gap-filling approachCHEN NENG-KUO·Filed 2010·Granted Nov 27, 2012·33 cites·32 claims
- 0393US9281331B2High dielectric constant structure for the vertical transfer gates of a complementary metal-oxide semiconductor (CMOS) image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 8, 2016·16 cites·12 claims
- 0490US10468486B2SOI substrate, semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 5, 2019·5 cites·20 claims
- 0589US11855159B2Method for forming thin semiconductor-on-insulator (SOI) substratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·1 cites·20 claims
- 0688US9245792B2Method for forming interconnect structuresCHEN NENG-KUO·Filed 2008·Granted Jan 26, 2016·14 cites·21 claims
- 0785US11955496B2Back-side deep trench isolation structure for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 9, 2024·1 cites·20 claims
- 0884US12211877B2Back-side deep trench isolation structure for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 0984US10504716B2Method for manufacturing semiconductor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·3 cites·20 claims
- 1083US2024379712A1Back-side deep trench isolation structure for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1179US8187948B2Hybrid gap-fill approach for STI formationCHEN NENG-KUO·Filed 2008·Granted May 29, 2012·7 cites·19 claims
- 1275US8546242B2Hybrid gap-fill approach for STI formationCHEN NENG-KUO·Filed 2012·Granted Oct 1, 2013·3 cites·15 claims
- 1374US11087971B2Method for manufacturing semiconductor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·1 cites·20 claims
- 1474US10658474B2Method for forming thin semiconductor-on-insulator (SOI) substratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 19, 2020·1 cites·20 claims
- 1573US7892929B2Shallow trench isolation corner roundingTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Feb 22, 2011·5 cites·20 claims
- 1672US12237165B2Method for wafer bonding including edge trimmingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 25, 2025·0 cites·20 claims
- 1770US2024355763A1Electronic device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 1869US11264469B2Method for forming thin semiconductor-on-insulator (SOI) substratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·0 cites·20 claims
- 1967US9159808B2Selective etch-back process for semiconductor devicesCHEN NENG-KUO·Filed 2009·Granted Oct 13, 2015·2 cites·20 claims
- 2064US12027469B2Electronic device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jul 2, 2024·0 cites·10 claims
- 2161US8173516B2Method of forming shallow trench isolation structureCHEN NENG-KUO·Filed 2010·Granted May 8, 2012·1 cites·11 claims
- 2260US11164945B2SOI substrate, semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·0 cites·20 claims
- 2357US10204822B2Method for forming trench liner passivationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 12, 2019·0 cites·20 claims
- 2453US9917003B2Trench liner passivation for dark current improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 13, 2018·0 cites·10 claims
- 2539US11063117B2Semiconductor device structure having carrier-trapping layers with different grain sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 13, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →