Inventor · disambiguated record
Anton Legen
Also filed as: LEGEN ANTON
7 granted patents·11 pending applications·126 citations·filing 2003–2008
85Inventor score
Technology areasH10W
Top patents by PatentIndex Score
18 records- 0189US7796393B2Assembly device and assembly method for a cooling elementQIMONDA AG·Filed 2007·Granted Sep 14, 2010·25 cites·16 claims
- 0289US6894381B2Electronic device having a stack of semiconductor chips and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 17, 2005·68 cites·18 claims
- 0383US7781900B2Semiconductor device comprising a housing and a semiconductor chip partly embedded in a plastic housing composition, and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2005·Granted Aug 24, 2010·14 cites·23 claims
- 0475US7253514B2Self-supporting connecting element for a semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2005·Granted Aug 7, 2007·7 cites·16 claims
- 0572US7256070B2Substrate-based housing component with a semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2005·Granted Aug 14, 2007·6 cites·10 claims
- 0671US7368322B2Method for mounting a chip on a base and arrangement produced by this methodINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 6, 2008·6 cites·24 claims
- 0743US2009175016A1Clip for attaching panelsQIMONDA AG·Filed 2008·Application pending·0 cites
- 0842US7517727B2Method for connection of an integrated circuit to a substrate, and a corresponding circuit arrangementINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 14, 2009·0 cites·7 claims
- 0942US2009002951A1System having a heat transfer apparatusQIMONDA AG·Filed 2007·Application pending·0 cites
- 1041US2009109613A1Memory module heat sinkQIMONDA AG·Filed 2007·Application pending·0 cites
- 1140US2008032446A1combination heat dissipation device with termination and a method of making the sameWOOD STEVE·Filed 2006·Application pending·0 cites
- 1239US2009251857A1System including an electronic module with a heat spreaderQIMONDA AG·Filed 2008·Application pending·0 cites
- 1337US2007217160A1Memory Module Including a Cooling Element, Method for Producing the Memory Module Including a Cooling Element, and Data Processing Device Comprising a Memory Module Including a Cooling ElementQIMONDA AG·Filed 2007·Application pending·0 cites
- 1436US2009129012A1Method and apparatus for heat transferLEGEN ANTON·Filed 2007·Application pending·0 cites
- 1533US2009290301A1Heat sink for an electronic deviceLEGEN ANTON·Filed 2008·Application pending·0 cites
- 1631US2006017149A1Substrate-based BGA package, in particular FBGA packageREISS MARTIN·Filed 2005·Application pending·0 cites
- 1730US2005285247A1Substrate-based die package with BGA or BGA-like componentsREISS MARTIN·Filed 2005·Application pending·0 cites
- 1830US2005285266A1Arrangement for increasing the reliability of substrate-based BGA packagesREISS MARTIN·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Anton Legen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →