Inventor · disambiguated record
Tse-Hsine Laio
Also filed as: LAIO TSE-HSINE · LIAO TSE-HSINE
3 granted patents·29 citations·filing 2006–2006
64Inventor score
Files withGIGA BYTE TECH CO LTD3
Top patents by PatentIndex Score
3 records- 0188US7295441B1Heat dissipating type printed circuit board and structure thereof for conducting heat with heap pipeGIGA BYTE TECH CO LTD·Filed 2006·Granted Nov 13, 2007·25 cites·17 claims
- 0269US7300315B2Structure of interface card connectorGIGA BYTE TECH CO LTD·Filed 2006·Granted Nov 27, 2007·4 cites·3 claims
- 0342US7474541B2Printed circuit board and heat dissipating metal surface layout thereofGIGA BYTE TECH CO LTD·Filed 2006·Granted Jan 6, 2009·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →