Inventor · disambiguated record
Hiroshi Takamichi
Also filed as: TAKAMICHI HIROSHI
3 granted patents·160 citations·filing 1994–1998
76Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0180US6054755ASemiconductor package with improved moisture vapor relief function and method of fabricating the sameSUMITOMO METAL SMI ELECTRONICS·Filed 1998·Granted Apr 25, 2000·88 cites·6 claims
- 0275US6199273B1Method of forming connector structure for a ball-grid arraySUMITOMO METAL IND·Filed 1996·Granted Mar 13, 2001·57 cites·14 claims
- 0342US5463248ASemiconductor package using an aluminum nitride substrateTOSHIBA KK·Filed 1994·Granted Oct 31, 1995·15 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →