Inventor · disambiguated record
Lay Wai Kong
Also filed as: Kong Lay Wai
2 granted patents·1 pending application·8 citations·filing 2015–2025
48Inventor score
Top patents by PatentIndex Score
3 records- 0193US9505607B2Methods of forming sensor integrated packages and structures formed therebyINTEL CORP·Filed 2015·Granted Nov 29, 2016·8 cites·22 claims
- 0271US2025377831A1Computational data storage systemsSK HYNIX NAND PRODUCT SOLUTIONS CORP DBA SOLIDIGM·Filed 2025·Application pending·0 cites
- 0361US12282683B2Computational data storage systemsINTEL CORP·Filed 2020·Granted Apr 22, 2025·0 cites·28 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →