Inventor · disambiguated record
Chua Swee Kwang
Also filed as: KWANG CHUA S · KWANG CHUA SWEE
27 granted patents·1 pending application·1,278 citations·filing 2001–2019
97Inventor score
Top patents by PatentIndex Score
28 records- 0199US6611052B2Wafer level stackable semiconductor packageMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 26, 2003·261 cites·39 claims
- 0299US6582992B2Stackable semiconductor package and wafer level fabrication methodMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 24, 2003·283 cites·19 claims
- 0397US6949407B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 27, 2005·42 cites·18 claims
- 0497US6727116B2Semiconductor devices including peripherally located bond pads, assemblies, packages, and methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 27, 2004·149 cites·25 claims
- 0596US8174105B2Stacked semiconductor package having discrete componentsKWANG CHUA SWEE·Filed 2011·Granted May 8, 2012·72 cites·20 claims
- 0696US6855572B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 15, 2005·96 cites·41 claims
- 0795US7358154B2Method for fabricating packaged dieMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 15, 2008·30 cites·24 claims
- 0894US7723831B2Semiconductor package having die with recess and discrete component embedded within the recessMICRON TECHNOLOGY INC·Filed 2007·Granted May 25, 2010·24 cites·10 claims
- 0994US7285850B2Support elements for semiconductor devices with peripherally located bond padsMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 23, 2007·26 cites·27 claims
- 1094US7115984B2Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 3, 2006·67 cites·10 claims
- 1194US6894386B2Apparatus and method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2002·Granted May 17, 2005·69 cites·30 claims
- 1293US6818977B2Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packagesMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 16, 2004·60 cites·43 claims
- 1392US7964946B2Semiconductor package having discrete components and system containing the packageMICRON TECHNOLOGY INC·Filed 2010·Granted Jun 21, 2011·10 cites·20 claims
- 1492US7807502B2Method for fabricating semiconductor packages with discrete componentsMICRON TECHNOLOGY INC·Filed 2010·Granted Oct 5, 2010·10 cites·20 claims
- 1588US7528477B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted May 5, 2009·10 cites·22 claims
- 1687US10431531B2Semiconductor dies with recesses, associated leadframes, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 1, 2019·3 cites·19 claims
- 1786US7679179B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 16, 2010·8 cites·19 claims
- 1885US9484225B2Method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2013·Granted Nov 1, 2016·4 cites·7 claims
- 1985US8008126B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2009·Granted Aug 30, 2011·7 cites·14 claims
- 2084US7675169B2Apparatus and method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 9, 2010·9 cites·20 claims
- 2179US9679834B2Semiconductor dies with recesses, associated leadframes, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Jun 13, 2017·2 cites·17 claims
- 2277US8138617B2Apparatus and method for packaging circuitsPOO CHIA YONG·Filed 2004·Granted Mar 20, 2012·19 cites·15 claims
- 2375US7226809B2Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methodsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 5, 2007·15 cites·48 claims
- 2470US7276387B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 2, 2007·2 cites·19 claims
- 2564US10811278B2Method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 20, 2020·0 cites·13 claims
- 2658US10453704B2Method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2016·Granted Oct 22, 2019·0 cites·14 claims
- 2758US10074599B2Semiconductor dies with recesses, associated leadframes, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 11, 2018·0 cites·24 claims
- 2853US2009026592A1Semiconductor dies with recesses, associated leadframes, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →