Inventor · disambiguated record
Hsien-Che Teng
Also filed as: TENG HSIEN-CHE
3 granted patents·5 pending applications·5 citations·filing 2004–2016
56Inventor score
Top patents by PatentIndex Score
8 records- 0157US7538024B2Method of fabricating a dual-damascene copper structureUNITED MICROELECTRONICS CORP·Filed 2005·Granted May 26, 2009·2 cites·21 claims
- 0251US2006292896A1Heater for heating a wafer and method for preventing contamination of the heaterTENG HSIEN-CHE·Filed 2006·Application pending·0 cites
- 0347US2006144337A1Heater for heating a wafer and method for preventing contamination of the heaterTENG HSIEN-CHE·Filed 2005·Application pending·0 cites
- 0444US7189649B2Method of forming a material filmUNITED MICROELECTRONICS CORP·Filed 2004·Granted Mar 13, 2007·3 cites·24 claims
- 0539US2008067145A1Method of recycling dummy waferUNITED MICROELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 0635US2007066085A1Method of fabricating dielectric layerTENG HSIEN-CHE·Filed 2005·Application pending·0 cites
- 0731US9991154B2Method for fabricating a fin field effect transistor and a shallow trench isolationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 5, 2018·0 cites·20 claims
- 0830US2006102284A1Semiconductor manufacturing equipmentTENG HSIEN-CHE·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →