Inventor · disambiguated record
Vito J. Tuozzolo
Also filed as: TUOZZOLO VITO J
3 granted patents·287 citations·filing 1990–1993
78Inventor score
Technology areasH10W
Files withIBM3
Top patents by PatentIndex Score
3 records- 0191US5490040ASurface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular arrayIBM·Filed 1993·Granted Feb 6, 1996·162 cites·1 claims
- 0280US5032897AIntegrated thermoelectric coolingIBM·Filed 1990·Granted Jul 16, 1991·74 cites·16 claims
- 0372US5012325AThermoelectric cooling via electrical connectionsIBM·Filed 1990·Granted Apr 30, 1991·51 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Vito J. Tuozzolo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →