Inventor · disambiguated record
Jian Chen
Also filed as: CHEN JIAN · CHEN JIAN HUNG · Chen Jian-Shian
12 granted patents·4 pending applications·28 citations·filing 2002–2025
86Inventor score
Files withMELEXIS TECHNOLOGIES NV7TAIWAN SEMICONDUCTOR MFG CO LTD7MELEXIS TECH N V1TAIWAN SEMICONDUCTOR MFG1
Top patents by PatentIndex Score
16 records- 0195US9431536B1Semiconductor device structure with raised source/drain having cap elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 30, 2016·17 cites·18 claims
- 0287US10308502B2Semiconductor pressure sensor for harsh media applicationMELEXIS TECHNOLOGIES NV·Filed 2017·Granted Jun 4, 2019·7 cites·20 claims
- 0380US2023275126A1Semiconductor device with cap elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0477US10006822B2Semiconductor sensor assembly for harsh media applicationMELEXIS TECHNOLOGIES NV·Filed 2017·Granted Jun 26, 2018·3 cites·16 claims
- 0575US2025301683A1Isolation structures in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0672US11688769B2Semiconductor device with cap elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 27, 2023·0 cites·20 claims
- 0770US12349383B2Isolation structures in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 0869US10165639B2Integrated LED deviceMELEXIS TECHNOLOGIES NV·Filed 2017·Granted Dec 25, 2018·1 cites·15 claims
- 0963US10818752B2Semiconductor device with cap elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 27, 2020·0 cites·20 claims
- 1058US10164013B2Formation method of semiconductor device structure with cap elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·0 cites·20 claims
- 1151US10217874B2Semiconductor device having a transparent window for passing radiationMELEXIS TECHNOLOGIES NV·Filed 2017·Granted Feb 26, 2019·0 cites·7 claims
- 1250US11169039B2Pressure sensor device and method of sensing pressureMELEXIS TECHNOLOGIES NV·Filed 2019·Granted Nov 9, 2021·0 cites·17 claims
- 1350US2024210262A1Protection of sensing element during mouldingMELEXIS TECHNOLOGIES NV·Filed 2023·Application pending·0 cites
- 1448US11600559B2Sensor device and method of manufactureMELEXIS TECHNOLOGIES NV·Filed 2019·Granted Mar 7, 2023·0 cites·18 claims
- 1547US9620656B2Semiconductor device having a transparent window for passing radiationMELEXIS TECH N V·Filed 2015·Granted Apr 11, 2017·0 cites·4 claims
- 1631US2003181042A1Etching uniformity in wet bench toolsTAIWAN SEMICONDUCTOR MFG·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →