Inventor · disambiguated record
Sang Joon Lim
Also filed as: LIM SANG JOON
10 granted patents·5 pending applications·30 citations·filing 2008–2019
84Inventor score
Top patents by PatentIndex Score
15 records- 0187US10115708B2Semiconductor package having a redistribution line structureSK HYNIX INC·Filed 2017·Granted Oct 30, 2018·6 cites·20 claims
- 0287US7808072B2Circuit board having conductive shield member and semiconductor package using the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Oct 5, 2010·16 cites·7 claims
- 0374US8441116B2Semiconductor package having substrate for high speed semiconductor packageLEE WOONG SUN·Filed 2012·Granted May 14, 2013·4 cites·17 claims
- 0471US8084839B2Circuit board having conductive shield member and semiconductor package using the sameCHOI BOK KYU·Filed 2010·Granted Dec 27, 2011·3 cites·6 claims
- 0559US9609742B2Electrical characteristics of package substrates and semiconductor packages including the sameSK HYNIX INC·Filed 2013·Granted Mar 28, 2017·1 cites·8 claims
- 0651US10615129B2Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structureSK HYNIX INC·Filed 2018·Granted Apr 7, 2020·0 cites·9 claims
- 0751US2013078807A1Wafer level chip scale package having an enhanced heat exchange efficiency with an emf shield and a method for fabricating the sameSK HYNIX INC·Filed 2012·Application pending·0 cites
- 0850US2009184414A1Wafer level chip scale package having an enhanced heat exchange efficiency with an emf shield and a method for fabricating the samePARK CHANG JUN·Filed 2008·Application pending·0 cites
- 0949US8338921B2Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the samePARK CHANG JUN·Filed 2011·Granted Dec 25, 2012·0 cites·3 claims
- 1047US10157858B2Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structureSK HYNIX INC·Filed 2017·Granted Dec 18, 2018·0 cites·18 claims
- 1147US2009152708A1Substrate for high speed semiconductor package and semiconductor package having the sameLEE WOONG SUN·Filed 2008·Application pending·0 cites
- 1244US9231286B2Package substrate with band stop filter and semiconductor package including the sameSK HYNIX INC·Filed 2013·Granted Jan 5, 2016·0 cites·20 claims
- 1343US2020402959A1Stacked semiconductor package having an interposerSK HYNIX INC·Filed 2019·Application pending·0 cites
- 1440US10923434B2Semiconductor packages having EMI shielding layersSK HYNIX INC·Filed 2018·Granted Feb 16, 2021·0 cites·15 claims
- 1535US2019080999A1Package substrates with signal transmission paths relating to parasitic capacitance valuesSK HYNIX INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →