Inventor · disambiguated record
Volker Jaschke
Also filed as: JASCHKE VOLKER
4 granted patents·1 pending application·4 citations·filing 2009–2011
59Inventor score
Top patents by PatentIndex Score
5 records- 0173US8338284B2Stress engineering in a contact level of semiconductor devices by stressed conductive layers and an isolation spacerFROHBERG KAI·Filed 2010·Granted Dec 25, 2012·4 cites·15 claims
- 0244US2010055902A1Reducing critical dimensions of vias and contacts above the device level of semiconductor devicesFROHBERG KAI·Filed 2009·Application pending·0 cites
- 0339US8772843B2Oxide deposition by using a double liner approach for reducing pattern density dependence in sophisticated semiconductor devicesKRONHOLZ STEPHAN·Filed 2011·Granted Jul 8, 2014·0 cites·30 claims
- 0437US8415257B2Enhanced adhesion of PECVD carbon on dielectric materials by providing an adhesion interfaceRUELKE HARTMUT·Filed 2010·Granted Apr 9, 2013·0 cites·18 claims
- 0534US8987103B2Multi-step deposition of a spacer material for reducing void formation in a dielectric material of a contact level of a semiconductor deviceLENSKI MARKUS·Filed 2010·Granted Mar 24, 2015·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →