Inventor · disambiguated record
Kohsuke Arai
Also filed as: ARAI KOHSUKE
4 granted patents·1 pending application·3 citations·filing 2009–2014
58Inventor score
Top patents by PatentIndex Score
5 records- 0178US9504149B2Surface treated copper foil and laminate using the sameJX NIPPON MINING & METALS CORP·Filed 2013·Granted Nov 22, 2016·3 cites·19 claims
- 0253US9730332B2Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminateJX NIPPON MINING & METALS CORP·Filed 2013·Granted Aug 8, 2017·0 cites·20 claims
- 0351US9232650B2Surface treated copper foil and laminate using the sameJX NIPPON MINING & METALS CORP·Filed 2013·Granted Jan 5, 2016·0 cites·12 claims
- 0447US2016303829A1Surface Treated Copper Foil, Copper Clad Laminate, Printed Wiring Board, Electronic Apparatus and Method for Manufacturing Printed Wiring BoardJX NIPPON MINING & METALS CORP·Filed 2014·Application pending·0 cites
- 0543US8237814B2Imaging apparatus and stored picture image playback methodNAGAO SEIJI·Filed 2009·Granted Aug 7, 2012·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →