Inventor · disambiguated record
Samuel Mcknight
Also filed as: KARECKI LEGAL REPRESENTATIVE ANNA · MCKNIGHT SAMUEL · MCKNIGHT SAMUEL R · MCKNIGHT SAMUEL ROY
9 granted patents·6 pending applications·85 citations·filing 2000–2012
88Inventor score
Top patents by PatentIndex Score
15 records- 0184US8310259B2Silicon carrier space transformer and temporary chip attach burn-in vehicle for high density connectionsHAMEL HARVEY·Filed 2008·Granted Nov 13, 2012·12 cites·6 claims
- 0276US6960831B2Semiconductor device having a composite layer in addition to a barrier layer between copper wiring and aluminum bond padIBM·Filed 2003·Granted Nov 1, 2005·25 cites·12 claims
- 0373US7273804B2Internally reinforced bond padsIBM·Filed 2005·Granted Sep 25, 2007·6 cites·9 claims
- 0470US7546670B2Method for producing thermally matched probe assemblyIBM·Filed 2006·Granted Jun 16, 2009·6 cites·20 claims
- 0570US6864578B2Internally reinforced bond padsIBM·Filed 2003·Granted Mar 8, 2005·16 cites·7 claims
- 0663US9159616B2Silicon carrier space transformer and temporary chip attach burn-in vehicle for high density connectionsHAMEL HARVEY·Filed 2012·Granted Oct 13, 2015·1 cites·7 claims
- 0763US7252514B2High density space transformer and method of fabricating sameIBM·Filed 2004·Granted Aug 7, 2007·10 cites·31 claims
- 0861US6747472B2Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the sameIBM·Filed 2002·Granted Jun 8, 2004·8 cites·22 claims
- 0955US8524596B2Techniques for improving bond pad performanceBEAULIEU FREDERIC·Filed 2012·Granted Sep 3, 2013·1 cites·20 claims
- 1047US2009001248A1Methods of Creating Molds of Variable Solder Volumes for Flip AttachFARINELLI MATTHEW J·Filed 2007·Application pending·0 cites
- 1147US2009004840A1Method of Creating Molds of Variable Solder Volumes for Flip AttachFARINELLI MATTHEW J·Filed 2007·Application pending·0 cites
- 1246US2006249854A1Device with area array pads for test probingCHENG TIEN-JEN·Filed 2006·Application pending·0 cites
- 1343US2006244138A1Techniques for improving bond pad performanceIBM·Filed 2005·Application pending·0 cites
- 1440US2005167837A1Device with area array pads for test probingIBM·Filed 2004·Application pending·0 cites
- 1533US2002070450A1Bond pad structure for integrated circuitsFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →