Inventor · disambiguated record
Leon Khilchenko
Also filed as: KHILCHENKO LEON · KHILCHENKO LEON M
9 granted patents·202 citations·filing 2003–2019
88Inventor score
Top patents by PatentIndex Score
9 records- 0198US8382524B2Electrical connector having thick film layersAMPHENOL CORP·Filed 2011·Granted Feb 26, 2013·141 cites·31 claims
- 0293US10186814B2Electrical connector having a film layerAMPHENOL CORP·Filed 2013·Granted Jan 22, 2019·21 cites·43 claims
- 0379US7508681B2Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristicsAMPHENOL CORP·Filed 2007·Granted Mar 24, 2009·7 cites·19 claims
- 0475US7242592B2Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristicsAMPHENOL CORP·Filed 2003·Granted Jul 10, 2007·20 cites·20 claims
- 0567US7240425B2Method of making an electrical connection to a conductor on an inner layer of a multi-layer printed circuit boardAMPHENOL CORP·Filed 2003·Granted Jul 10, 2007·10 cites·6 claims
- 0662US7484971B2Electronic component with high density, low cost attachmentAMPHENOL CORP·Filed 2006·Granted Feb 3, 2009·2 cites·31 claims
- 0755US8115110B2Printed circuit board minimizing undesirable signal reflections in a via and methods thereforKHILCHENKO LEON M·Filed 2007·Granted Feb 14, 2012·1 cites·17 claims
- 0853US11336060B2Electrical connector having thick film layersAMPHENOL CORP·Filed 2019·Granted May 17, 2022·0 cites·11 claims
- 0948US7630210B2Lead(Pb)-free electronic component attachmentAMPHENOL CORP·Filed 2006·Granted Dec 8, 2009·0 cites·44 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →