Inventor · disambiguated record
Jung-Pin Huang
Also filed as: HUANG JUNG-PIN
10 granted patents·6 pending applications·60 citations·filing 2003–2014
87Inventor score
Technology areasH10W
Files withSILICONWARE PRECISION INDUSTRIES CO LTD13CHIANG CHENG-CHIA1LIU CHUNG-LUN1SILICON PREC IND CO LTD1
Top patents by PatentIndex Score
16 records- 0182US9058971B2Electro-optical moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Jun 16, 2015·7 cites·23 claims
- 0278US7193309B2Semiconductor package with stacked chips and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Mar 20, 2007·24 cites·8 claims
- 0370US8896130B2Multi-chip stack structure and method for fabricating the sameLIU CHUNG-LUN·Filed 2008·Granted Nov 25, 2014·6 cites·13 claims
- 0469US8304891B2Semiconductor package device, semiconductor package structure, and fabrication methods thereofCHIANG CHENG-CHIA·Filed 2008·Granted Nov 6, 2012·5 cites·11 claims
- 0564US9754927B2Method for fabricating multi-chip stack structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Sep 5, 2017·1 cites·13 claims
- 0663US8802507B2Fabrication method of semiconductor package device, and fabrication method of semiconductor package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Aug 12, 2014·1 cites·13 claims
- 0759US6737737B1Semiconductor package with chip supporting memberSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted May 18, 2004·9 cites·20 claims
- 0850US7102218B2Semiconductor package with chip supporting structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Sep 5, 2006·7 cites·8 claims
- 0950US2008174030A1Multichip stacking structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 1050US2009032928A1Multi-chip stack structure having through silicon via and method for fabrication the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 1149US2008176358A1Fabrication method of multichip stacking structureSILICON PREC IND CO LTD·Filed 2008·Application pending·0 cites
- 1248US7655503B2Method for fabricating semiconductor package with stacked chipsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Feb 2, 2010·0 cites·8 claims
- 1346US2011227226A1Multi-chip stack structure having through silicon viaSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2011·Application pending·0 cites
- 1445US7981729B2Fabrication method of multi-chip stack structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2010·Granted Jul 19, 2011·0 cites·16 claims
- 1545US2008283994A1Stacked package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 1645US2009014860A1Multi-chip stack structure and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →