Inventor · disambiguated record
Chung Sheung Yung
Also filed as: YUNG CHUNG SHEUNG · YUNG CHUNG SHEUNG TATE
10 granted patents·65 citations·filing 2004–2019
87Inventor score
Files withASM ASSEMBLY AUTOMATION LTD3CHOY PING KONG2YUNG CHUNG SHEUNG2ASM TECH SINGAPORE PTE LTD1ASMPT SINGAPORE PTE LTD1
Top patents by PatentIndex Score
10 records- 0193US10861819B1High-precision bond head positioning method and apparatusASM TECH SINGAPORE PTE LTD·Filed 2019·Granted Dec 8, 2020·14 cites·19 claims
- 0283US7845543B1Apparatus and method for bonding multiple diceASM ASSEMBLY AUTOMATION LTD·Filed 2009·Granted Dec 7, 2010·8 cites·16 claims
- 0382US8387851B1Apparatus for aligning a bonding tool of a die bonderYUNG CHUNG SHEUNG·Filed 2012·Granted Mar 5, 2013·9 cites·15 claims
- 0480US8733539B2Vibratory feeder for conveying componentsCHOY PING KONG·Filed 2012·Granted May 27, 2014·12 cites·11 claims
- 0574US7849896B2Bondhead alignment tool for a bonding apparatusASM ASSEMBLY AUTOMATION LTD·Filed 2008·Granted Dec 14, 2010·5 cites·20 claims
- 0672US8875979B2Apparatus and method for determining an alignment of a bondhead of a die bonder relative to a workchuckYUNG CHUNG SHEUNG·Filed 2012·Granted Nov 4, 2014·4 cites·10 claims
- 0771US8256103B2Actuator for maintaining alignment of die detachment toolsCHOY PING KONG·Filed 2010·Granted Sep 4, 2012·3 cites·17 claims
- 0859US7462960B2Driver for an ultrasonic transducer and an ultrasonic transducerUNIV HONG KONG POLYTECHNIC·Filed 2004·Granted Dec 9, 2008·10 cites·18 claims
- 0947US7649333B2Active damping device for a positioning stageASM ASSEMBLY AUTOMATION LTD·Filed 2007·Granted Jan 19, 2010·0 cites·18 claims
- 1042US11776930B2Die bond head apparatus with die holder motion tableASMPT SINGAPORE PTE LTD·Filed 2019·Granted Oct 3, 2023·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →