Inventor · disambiguated record
Jae-Bum Byun
Also filed as: BYUN JAE-BUM
2 granted patents·1 pending application·23 citations·filing 2012–2015
59Inventor score
Top patents by PatentIndex Score
3 records- 0191US9668377B2Storage deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 30, 2017·19 cites·15 claims
- 0279US9564417B2Multi-stacked structures of semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 7, 2017·4 cites·19 claims
- 0338US2013208426A1Semiconductor package having heat spreader and method of forming the sameKIM JAE-CHOON·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →