Inventor · disambiguated record
Robert Michael Smythe
Also filed as: SMYTHE ROBERT MICHAEL
6 granted patents·5 pending applications·118 citations·filing 2009–2014
85Inventor score
Top patents by PatentIndex Score
11 records- 0196US8081468B2Memory modules including compliant multilayered thermally-conductive interface assembliesHILL RICHARD F·Filed 2009·Granted Dec 20, 2011·44 cites·12 claims
- 0295US9222735B2Compliant multilayered thermally-conductive interface assembliesLAIRD TECHNOLOGIES INC·Filed 2014·Granted Dec 29, 2015·20 cites·21 claims
- 0393US8837151B2Memory modules including compliant multilayered thermally-conductive interface assembliesHILL RICHARD F·Filed 2011·Granted Sep 16, 2014·21 cites·21 claims
- 0489US9322580B2Circuit assemblies including thermoelectric modulesLAIRD TECHNOLOGIES INC·Filed 2014·Granted Apr 26, 2016·10 cites·24 claims
- 0589US8649179B2Circuit assemblies including thermoelectric modulesHERSHBERGER JEFFREY GERARD·Filed 2011·Granted Feb 11, 2014·19 cites·26 claims
- 0660US8193439B2Thermoelectric modules and related methodsSMYTHE ROBERT MICHAEL·Filed 2009·Granted Jun 5, 2012·4 cites·27 claims
- 0760US2010321897A1Compliant multilayered thermally-conductive interface assembliesLAIRD TECHNOLOGIES INC·Filed 2009·Application pending·0 cites
- 0849US2011000516A1Flexible assemblies with integrated thermoelectric modules suitable for use in extracting power from or dissipating heat from fluid conduitsLAIRD TECHNOLOGIES INC·Filed 2010·Application pending·0 cites
- 0944US2011030754A1Thermoelectric modules and related methodsLAIRD TECHNOLOGIES INC·Filed 2009·Application pending·0 cites
- 1041US2012061135A1Compliant multilayered thermally-conductive interface assemblies having emi shielding propertiesHILL RICHARD F·Filed 2010·Application pending·0 cites
- 1140US2012174956A1Thermoelectric Modules, Thermoelectric Assemblies, and Related MethodsSMYTHE ROBERT MICHAEL·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →