Inventor · disambiguated record
Hsien-Shou Wang
Also filed as: WANG HSIEN S · WANG HSIEN-SHOU
7 granted patents·4 pending applications·70 citations·filing 2006–2011
84Inventor score
Top patents by PatentIndex Score
11 records- 0190US7626270B2Coreless package substrate with conductive structuresPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Dec 1, 2009·21 cites·6 claims
- 0288US7906850B2Structure of circuit board and method for fabricating sameUNIMICRON TECHNOLOGY CORP·Filed 2006·Granted Mar 15, 2011·19 cites·3 claims
- 0383US7820233B2Method for fabricating a flip chip substrate structureUNIMICRON TECHNOLOGY CORP·Filed 2006·Granted Oct 26, 2010·13 cites·26 claims
- 0481US7435618B2Method to manufacture a coreless packaging substratePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Oct 14, 2008·8 cites·11 claims
- 0572US7419850B2Method to manufacture a coreless packaging substratePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Sep 2, 2008·4 cites·11 claims
- 0667US7867888B2Flip-chip package substrate and a method for fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2007·Granted Jan 11, 2011·3 cites·7 claims
- 0761US8709940B2Structure of circuit board and method for fabricating the sameWANG SHING-RU·Filed 2011·Granted Apr 29, 2014·2 cites·17 claims
- 0846US2008122079A1Package substrate and manufacturing method thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 0943US2008060838A1Flip chip substrate structure and the method for manufacturing the samePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Application pending·0 cites
- 1038US2006284640A1Structure of circuit board and method for fabricating the sameWANG SHING-RU·Filed 2006·Application pending·0 cites
- 1134US2007017815A1Circuit board structure and method for fabricating the sameWANG SHING-RU·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →