Inventor · disambiguated record
Cheng-Yi Weng
Also filed as: WENG CHENG-YI
7 granted patents·4 pending applications·304 citations·filing 2009–2016
87Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG3CHU CHI-CHIH3CHEN KUANG-HSIUNG2WENG CHENG-YI2CHIPMOS TECHNOLOGIES INC1
Top patents by PatentIndex Score
11 records- 0198US8012797B2Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometriesADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Sep 6, 2011·146 cites·20 claims
- 0293US8076765B2Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductorsCHEN KUANG-HSIUNG·Filed 2009·Granted Dec 13, 2011·52 cites·25 claims
- 0391US7838334B2Package-on-package device, semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Nov 23, 2010·71 cites·20 claims
- 0488US8405212B2Semiconductor packageCHU CHI-CHIH·Filed 2010·Granted Mar 26, 2013·16 cites·20 claims
- 0588US8198131B2Stackable semiconductor device packagesWENG CHENG-YI·Filed 2010·Granted Jun 12, 2012·15 cites·20 claims
- 0668US8569885B2Stacked semiconductor packages and related methodsWENG CHENG-YI·Filed 2011·Granted Oct 29, 2013·3 cites·20 claims
- 0763US9735132B1Semiconductor packageCHIPMOS TECHNOLOGIES INC·Filed 2016·Granted Aug 15, 2017·1 cites·10 claims
- 0847US2010032822A1Chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2009·Application pending·0 cites
- 0945US2013161816A1Semiconductor packageCHU CHI-CHIH·Filed 2013·Application pending·0 cites
- 1044US2012049338A1Stackable semiconductor device packagesCHEN KUANG-HSIUNG·Filed 2011·Application pending·0 cites
- 1142US2010171206A1Package-on-Package Device, Semiconductor Package, and Method for Manufacturing The SameCHU CHI-CHIH·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →