Inventor · disambiguated record
Tsung-Yuan Chen
Also filed as: CHEN TSUNG Y · CHEN TSUNG-YUAN
66 granted patents·15 pending applications·1,294 citations·filing 1995–2025
99Inventor score
Files withUNIMICRON TECHNOLOGY CORP20CHEN TSUNG-YUAN14HITACHI GLOBAL STORAGE TECH11TSENG TZYY-JANG6WESTERN DIGITAL FREMONT LLC6
Top patents by PatentIndex Score
81 records- 0199US8277669B1Method and system for providing a perpendicular magnetic recording pole having a leading edge bevelCHEN TSUNG YUAN·Filed 2009·Granted Oct 2, 2012·166 cites·22 claims
- 0299US8018678B1Method for simultaneous electronic lapping guide (ELG) and perpendicular magnetic recording (PMR) pole formationWESTERN DIGITAL FREMONT LLC·Filed 2008·Granted Sep 13, 2011·157 cites·20 claims
- 0398US8649123B1Method to eliminate reactive ion etching (RIE) loading effects for damascene perpendicular magnetic recording (PMR) fabricationZHANG JINQIU·Filed 2008·Granted Feb 11, 2014·147 cites·16 claims
- 0498US8334093B2Method and system for providing a perpendicular magnetic recording headZHANG JINQIU·Filed 2008·Granted Dec 18, 2012·150 cites·16 claims
- 0598US8310785B1Perpendicular magnetic recording headZHANG JINQIU·Filed 2012·Granted Nov 13, 2012·147 cites·8 claims
- 0698US8136225B1Method and system for providing a perpendicular magnetic recording headZHANG JINQIU·Filed 2008·Granted Mar 20, 2012·153 cites·14 claims
- 0796US7477481B2Bilayer trailing shield gap for perpendicular headHITACHI GLOBAL STORAGE TECH·Filed 2005·Granted Jan 13, 2009·31 cites·20 claims
- 0893US7186348B2Method for fabricating a pole tip in a magnetic transducerHITACHI GLOBAL STORAGE TECH·Filed 2004·Granted Mar 6, 2007·36 cites·17 claims
- 0992US7841068B2Methods of fabricating single-pole recording head having trapezoidal main pole and bevel angle promotion layerHITACHI GLOBAL STORAGE TECH NL·Filed 2007·Granted Nov 30, 2010·12 cites·11 claims
- 1092US7804662B2Perpendicular magnetic recording head including wrap around shield with notched top write gap and method of fabricating the sameHITACHI GLOBAL STORAGE TECH·Filed 2006·Granted Sep 28, 2010·14 cites·17 claims
- 1192US7253992B2Single-pole recording head having trapezoidal main pole and bevel angle promotion layer and methods of fabricating the sameHITACHI GLOBAL STORAGE TECH·Filed 2004·Granted Aug 7, 2007·49 cites·11 claims
- 1291US8111479B2Perpendicular magnetic recording head having a notched trailing shieldCHEN TSUNG YUAN·Filed 2007·Granted Feb 7, 2012·11 cites·16 claims
- 1389US7633713B2Method for controlling the formation of the trailing shield gap during perpendicular head fabrication and head formed therebyHITACHI GLOBAL STORAGE TECH·Filed 2005·Granted Dec 15, 2009·9 cites·7 claims
- 1487US9161454B2Electrical device package structure and method of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2012·Granted Oct 13, 2015·8 cites·4 claims
- 1587US8604359B2Package substrate and fabrication method thereofCHEN TSUNG-YUAN·Filed 2011·Granted Dec 10, 2013·8 cites·6 claims
- 1687US5705222AProcess for preparing nanocomposite particlesUNIV COLUMBIA·Filed 1995·Granted Jan 6, 1998·78 cites·17 claims
- 1785US8322679B2Container data centerCHEN TSUNG-YUAN·Filed 2011·Granted Dec 4, 2012·6 cites·5 claims
- 1885US7377024B2Method of making a magnetic write head with trailing shield throat padHITACHI GLOBAL STORAGE TECH·Filed 2005·Granted May 27, 2008·15 cites·7 claims
- 1985US6344952B1Serpentine resistive shunt for MR heads having conductive shieldsIBM·Filed 2000·Granted Feb 5, 2002·18 cites·2 claims
- 2083US2025324767A1Electrostatic discharge protection for integrated circuit during back end-of-line processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2180US12369406B2Electrostatic discharge protection for integrated circuit during back end-of-line processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 22, 2025·0 cites·20 claims
- 2279US7774932B2Circuit board processUNIMICRON TECHNOLOGY CORP·Filed 2007·Granted Aug 17, 2010·8 cites·12 claims
- 2379US7733662B2Circuit board with embedded passive component and fabricating process thereofUNIMICRON TECHNOLOGY CORP·Filed 2007·Granted Jun 8, 2010·6 cites·9 claims
- 2474US9536064B2Method of operating an electronic apparatusWISTRON CORP·Filed 2014·Granted Jan 3, 2017·4 cites·10 claims
- 2574US9084379B2Process for fabricating wiring boardCHEN TSUNG-YUAN·Filed 2012·Granted Jul 14, 2015·2 cites·13 claims
- 2674US8273256B2Method for manufacturing wiring structure of wiring boardCHIANG SHU-SHENG·Filed 2010·Granted Sep 25, 2012·2 cites·17 claims
- 2774US8164004B2Embedded circuit structure and fabricating process of the sameCHEN TSUNG-YUAN·Filed 2007·Granted Apr 24, 2012·5 cites·1 claims
- 2873US11764206B2Electrostatic discharge protection for integrated circuit during back end-of-line processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 2973US9786304B1Method for providing heat assisted magnetic recording write apparatus having a near-field transducer with a sloped noseWESTERN DIGITAL (FREMONT) LLC·Filed 2016·Granted Oct 10, 2017·3 cites·13 claims
- 3073US9510464B2Manufacturing method of circuit boardTSENG TZYY-JANG·Filed 2012·Granted Nov 29, 2016·2 cites·12 claims
- 3173US8729397B2Embedded structureLIU YI-CHUN·Filed 2011·Granted May 20, 2014·2 cites·20 claims
- 3273US8424202B2Process for fabricating a circuit boardTSENG TZYY-JANG·Filed 2010·Granted Apr 23, 2013·2 cites·13 claims
- 3372US8735742B2Shielding apparatus and cabinet with sameCHEN TSUNG-YUAN·Filed 2012·Granted May 27, 2014·2 cites·11 claims
- 3471US8294034B2Circuit board and process for fabricating the sameTSENG TZYY-JANG·Filed 2010·Granted Oct 23, 2012·3 cites·20 claims
- 3569US10106885B2Heat assisted magnetic recording head having near-field transducer with a sloped noseWESTERN DIGITAL FREMONT LLC·Filed 2017·Granted Oct 23, 2018·2 cites·20 claims
- 3669US9307651B2Fabricating process of embedded circuit structureCHEN TSUNG-YUAN·Filed 2012·Granted Apr 5, 2016·2 cites·7 claims
- 3769US8049114B2Package substrate with a cavity, semiconductor package and fabrication method thereofUNIMICRON TECHNOLOGY CORP·Filed 2009·Granted Nov 1, 2011·6 cites·4 claims
- 3868US8365401B2Circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2010·Granted Feb 5, 2013·2 cites·10 claims
- 3966US8288663B2Electrical interconnect structure and process thereof and circuit board structureCHEN TSUNG-YUAN·Filed 2008·Granted Oct 16, 2012·2 cites·15 claims
- 4066US8191248B2Method for making an embedded structureLIU YI-CHUN·Filed 2008·Granted Jun 5, 2012·2 cites·18 claims
- 4165US8519960B2Method and apparatus for switching of KVM switch ports using gestures on a touch panelCHU HUNG CHI·Filed 2009·Granted Aug 27, 2013·3 cites·5 claims
- 4265US8132321B2Method for making embedded circuit structureLIU YI-CHUN·Filed 2008·Granted Mar 13, 2012·2 cites·42 claims
- 4364US9881638B1Method for providing a near-field transducer (NFT) for a heat assisted magnetic recording (HAMR) deviceWESTERN DIGITAL (FREMONT) LLC·Filed 2014·Granted Jan 30, 2018·1 cites·9 claims
- 4464US8578598B2Fabricating method of embedded package structureCHEN TSUNG-YUAN·Filed 2009·Granted Nov 12, 2013·3 cites·11 claims
- 4562US8450621B2Wiring board and process for fabricating the sameCHEN TSUNG-YUAN·Filed 2008·Granted May 28, 2013·2 cites·4 claims
- 4661US8450623B2Circuit boardTSENG TZYY-JANG·Filed 2010·Granted May 28, 2013·1 cites·8 claims
- 4761US8273651B2Method for fabricating wiring structure of wiring boardCHIANG SHU-SHENG·Filed 2010·Granted Sep 25, 2012·1 cites·19 claims
- 4861US7536778B1Method of fabrication for slider with underpass leadsHITACHI GLOBAL STORAGE TECH·Filed 2007·Granted May 26, 2009·2 cites·6 claims
- 4960US7500303B2Method of fabricating a magnetic sensor on a waferHITACHI GLOBAL STORAGE TECH·Filed 2006·Granted Mar 10, 2009·2 cites·17 claims
- 5059US7742258B2Magnetic transducer with milling maskHITACHI GLOBAL STORAGE TECH·Filed 2007·Granted Jun 22, 2010·0 cites·5 claims
Showing the top 50 of 81 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →