Inventor · disambiguated record
Tzu-Chien Hung
Also filed as: HUNG TZU-CHIEN
42 granted patents·34 pending applications·88 citations·filing 1999–2023
96Inventor score
Files withADVANCED OPTOELECTRONIC TECH40HUNG TZU-CHIEN15SHEN CHIA-HUI10SOLID TECH CO LTD4ADVANCED OPTOELECTRONICS TECHNOLOGY INC1
Top patents by PatentIndex Score
76 records- 0195US9978728B2Display apparatus and fabricating method thereofINNOLUX CORP·Filed 2017·Granted May 22, 2018·14 cites·20 claims
- 0286US9190451B2Light emitting diode array and method for manufacturing the sameHUNG TZU-CHIEN·Filed 2012·Granted Nov 17, 2015·5 cites·11 claims
- 0385US8415179B2Method for manufacturing light emitting diodeHUNG TZU-CHIEN·Filed 2011·Granted Apr 9, 2013·4 cites·7 claims
- 0484US8247833B2LED package and manufacturing method thereofSHEN CHIA-HUI·Filed 2010·Granted Aug 21, 2012·8 cites·8 claims
- 0580US8759121B2Light emitting diode array and method for manufacturing the sameHUNG TZU-CHIEN·Filed 2011·Granted Jun 24, 2014·3 cites·5 claims
- 0680US8222662B2LED package structureSHEN CHIA-HUI·Filed 2010·Granted Jul 17, 2012·6 cites·14 claims
- 0775US8981406B2Light emitting diode die and light emitting diode package incorporating the sameADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Mar 17, 2015·2 cites·10 claims
- 0875US8288789B2LED packageHUNG TZU-CHIEN·Filed 2011·Granted Oct 16, 2012·4 cites·10 claims
- 0974US10020426B1Light emitting deviceADVANCED OPTOELECTRONIC TECH·Filed 2017·Granted Jul 10, 2018·2 cites·10 claims
- 1074US8513039B2Method for fabricating semiconductor lighting chipTU PO-MIN·Filed 2011·Granted Aug 20, 2013·2 cites·11 claims
- 1174US8492789B2Light emitting diode and method for manufacturing the sameHUNG TZU-CHIEN·Filed 2011·Granted Jul 23, 2013·3 cites·15 claims
- 1271US8501506B2Method for manufacturing light emitting diodeHUNG TZU-CHIEN·Filed 2011·Granted Aug 6, 2013·1 cites·13 claims
- 1371US6282146B1Dual supply voltage input/output bufferRISE TECHNOLOGY INC·Filed 1999·Granted Aug 28, 2001·28 cites·14 claims
- 1470US9054270B2Method for manufacturing light emitting diode chipADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Jun 9, 2015·2 cites·8 claims
- 1570US8535958B2Method for fabricating light emitting diodeHUNG TZU-CHIEN·Filed 2012·Granted Sep 17, 2013·1 cites·6 claims
- 1668US2021074884A1Light emitting diode structureADVANCED OPTOELECTRONIC TECH·Filed 2020·Application pending·0 cites
- 1764US10873006B2Light emitting diode structureADVANCED OPTOELECTRONIC TECH·Filed 2019·Granted Dec 22, 2020·0 cites·8 claims
- 1864US10297638B1Flexible light source structure and method for manufacturing sameADVANCED OPTOELECTRONIC TECH·Filed 2018·Granted May 21, 2019·1 cites·19 claims
- 1963US10050188B2Light emitting diode chip and display composed of light emitting diode chipsADVANCED OPTOELECTRONIC TECH·Filed 2017·Granted Aug 14, 2018·1 cites·11 claims
- 2062US9755112B2LED die with barrier layerADVANCED OPTOELECTRONIC TECH·Filed 2015·Granted Sep 5, 2017·1 cites·2 claims
- 2161US8912557B2Light emitting diode having N-face GaN with roughened surfaceADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Dec 16, 2014·0 cites·7 claims
- 2261US8772811B2Light emitting diodeADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Jul 8, 2014·0 cites·6 claims
- 2360US8823020B2Light emitting diodeADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Sep 2, 2014·0 cites·7 claims
- 2459US2024120244A1Carrier SubstrateSOLID TECH CO LTD·Filed 2023·Application pending·0 cites
- 2559US2024087979A1Carrier SubstrateSOLID TECH CO LTD·Filed 2023·Application pending·0 cites
- 2659US2024112979A1Carrier SubstrateSOLID TECH CO LTD·Filed 2023·Application pending·0 cites
- 2759US2009299903A1Non-Cash Cash-on-Delivery Method and SystemTAIWAN PELICAN EXPRESS CO LTD·Filed 2008·Application pending·0 cites
- 2858US2024107658A1Carrier SubstrateSOLID TECH CO LTD·Filed 2023·Application pending·0 cites
- 2957US10263148B1Light emitting diode structureADVANCED OPTOELECTRONIC TECH·Filed 2017·Granted Apr 16, 2019·0 cites·11 claims
- 3056US9171993B2LED die and method of manufacturing the sameADVANCED OPTOELECTRONIC TECH·Filed 2014·Granted Oct 27, 2015·0 cites·20 claims
- 3156US8501514B2Method for manufacturing light emitting diode by etching with alkaline solutionHUNG TZU-CHIEN·Filed 2011·Granted Aug 6, 2013·0 cites·12 claims
- 3256US2014342099A1Method of photocuring a coating filmADVANCED OPTOELECTRONIC TECH·Filed 2014·Application pending·0 cites
- 3350US2014361245A1Led chip and method of manufacturing the sameADVANCED OPTOELECTRONIC TECH·Filed 2014·Application pending·0 cites
- 3450US2014312299A1Light emitting diode chipADVANCED OPTOELECTRONIC TECH·Filed 2014·Application pending·0 cites
- 3550US2015140701A1Method for manufacturing light emitting diode packageADVANCED OPTOELECTRONIC TECH·Filed 2014·Application pending·0 cites
- 3650US2015087099A1Method for manufacturing light emitting diodeADVANCED OPTOELECTRONIC TECH·Filed 2014·Application pending·0 cites
- 3749US2014346540A1Light emitting diode dieADVANCED OPTOELECTRONIC TECH·Filed 2014·Application pending·0 cites
- 3848US9040329B2Light emitting diode and manufacturing method thereofSHEN CHIA-HUI·Filed 2012·Granted May 26, 2015·0 cites·14 claims
- 3948US8227282B2Method of manufacturing vertical light emitting diodeHUNG TZU-CHIEN·Filed 2011·Granted Jul 24, 2012·0 cites·11 claims
- 4048US2013309795A1Method for manufacturing led chip with inclined side surfaceTECHNOLOGY INC ADVANCED OPTOELECTRONIC·Filed 2013·Application pending·0 cites
- 4148US2014138615A1Light emitting diodeADVANCED OPTOELECTRONIC TECH·Filed 2013·Application pending·0 cites
- 4247US8846428B2Method for manufacturing light emitting diode chip with electrodes having smooth surfacesADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Sep 30, 2014·0 cites·14 claims
- 4347US2014001494A1Light emitting diodeADVANCED OPTOELECTRONIC TECH·Filed 2013·Application pending·0 cites
- 4447US2014001495A1Light emitting diode lampADVANCED OPTOELECTRONIC TECH·Filed 2013·Application pending·0 cites
- 4547US2013320362A1High voltage light emitting diode package and method for manufacuting the sameADVANCED OPTOELECTRONIC TECH·Filed 2013·Application pending·0 cites
- 4646US10418512B2Manufacturing method for light emitting diode crystal grains using adhesive layer on auxiliary substrate to fill gaps between light emitting diode crystal grainsADVANCED OPTOELECTRONIC TECH·Filed 2017·Granted Sep 17, 2019·0 cites·16 claims
- 4745US8258540B2LED packageHUNG TZU-CHIEN·Filed 2011·Granted Sep 4, 2012·0 cites·8 claims
- 4845US2013146837A1Light emitting diode with multiple transparent conductive layers and method for manufacturing the sameSHEN CHIA-HUI·Filed 2012·Application pending·0 cites
- 4945US2013075779A1Light emitting diode with multiple transparent conductive layers and method for manufacturing the sameSHEN CHIA-HUI·Filed 2012·Application pending·0 cites
- 5045US2013099254A1Light emitting diode with chamfered top peripheral edgeHUNG TZU-CHIEN·Filed 2012·Application pending·0 cites
Showing the top 50 of 76 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →