Inventor · disambiguated record
Robert Lyn
Also filed as: LYN ROBERT · LYN ROBERT J
5 granted patents·5 pending applications·235 citations·filing 1995–2021
81Inventor score
Top patents by PatentIndex Score
10 records- 0187US5658827AMethod for forming solder balls on a substrateIBM·Filed 1995·Granted Aug 19, 1997·119 cites·11 claims
- 0282US6896170B2Wire bonder for ball bonding insulated wire and method of using sameMICROBONDS INC·Filed 2002·Granted May 24, 2005·48 cites·19 claims
- 0380US6030889ASubstrate-holding fixture of non-wettable materialIBM·Filed 1997·Granted Feb 29, 2000·68 cites·4 claims
- 0465US12342824B2Metal-infused antimicrobial material and method of preparation thereofMICROBONDS INC·Filed 2021·Granted Jul 1, 2025·0 cites·22 claims
- 0550US2021329924A1Metal-based antimicrobial composition and method of usingMICROBONDS INC·Filed 2020·Application pending·0 cites
- 0645US10471679B2Metal graphic and method to produce a metal graphicSONG YOUNG KYU·Filed 2011·Granted Nov 12, 2019·0 cites·12 claims
- 0736US2008048344A1High performance ic package and methodLYN ROBERT·Filed 2007·Application pending·0 cites
- 0835US2015322586A1Bonding wire and process for manufacturing a bonding wireMICROBONDS INC·Filed 2012·Application pending·0 cites
- 0935US2007262119A1Wire bonding process for insulated wiresRAMKUMAR MALLIAH·Filed 2007·Application pending·0 cites
- 1034US2006175712A1High performance IC package and methodMICROBONDS INC·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →