Inventor · disambiguated record
Tomoyoshi Sakamoto
Also filed as: SAKAMOTO TOMOYOSHI
10 granted patents·1 pending application·30 citations·filing 1988–2011
85Inventor score
Files withMITSUBISHI MATERIALS CORP2MITSUBISHI METAL CORP2OJIRO MINORU2SAKAMOTO TOMOYOSHI2RP TOPLA LTD1
Top patents by PatentIndex Score
11 records- 0171US8827690B2Hollow body molding deviceSAKAMOTO TOMOYOSHI·Filed 2011·Granted Sep 9, 2014·3 cites·5 claims
- 0271US7597507B2Insert type cutting instrument and insert, method for attaching insert to insert main bodyMITSUBISHI MATERIALS CORP·Filed 2007·Granted Oct 6, 2009·11 cites·9 claims
- 0369US8679397B2Method of manufacturing hollow bodySAKAMOTO TOMOYOSHI·Filed 2010·Granted Mar 25, 2014·3 cites·6 claims
- 0461US8550154B2Resin heat exchanger unit, method for manufacturing the resin heat exchanger unit, and heat exchangerOJIRO MINORU·Filed 2009·Granted Oct 8, 2013·3 cites·7 claims
- 0558US10155268B2Cutting edge configuration of cutting toolTAKASHIMA KAZUHIKO·Filed 2005·Granted Dec 18, 2018·1 cites·6 claims
- 0648US6679657B2Tool for bore diameter workMITSUBISHI MATERIALS CORP·Filed 2002·Granted Jan 20, 2004·3 cites·11 claims
- 0743US2011210482A1Resin molded body and method for manufacturing the sameRP TOPLA LTD·Filed 2009·Application pending·0 cites
- 0837US8709333B2Method of manufacturing pipe with branchOJIRO MINORU·Filed 2010·Granted Apr 29, 2014·0 cites·8 claims
- 0936US8231953B2Transparent plastic container for anticounterfeit systemTAKEUCHI ITSUO·Filed 2007·Granted Jul 31, 2012·0 cites·6 claims
- 1031US4899719AApparatus for collecting wafersMITSUBISHI METAL CORP·Filed 1988·Granted Feb 13, 1990·5 cites·5 claims
- 1127US4974577AApparatus for collecting wafersMITSUBISHI METAL CORP·Filed 1990·Granted Dec 4, 1990·1 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →